JPS5548700B2 - - Google Patents

Info

Publication number
JPS5548700B2
JPS5548700B2 JP1228573A JP1228573A JPS5548700B2 JP S5548700 B2 JPS5548700 B2 JP S5548700B2 JP 1228573 A JP1228573 A JP 1228573A JP 1228573 A JP1228573 A JP 1228573A JP S5548700 B2 JPS5548700 B2 JP S5548700B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1228573A
Other languages
Japanese (ja)
Other versions
JPS49100566A (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1228573A priority Critical patent/JPS5548700B2/ja
Priority to US436801A priority patent/US3908184A/en
Publication of JPS49100566A publication Critical patent/JPS49100566A/ja
Publication of JPS5548700B2 publication Critical patent/JPS5548700B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
JP1228573A 1973-01-30 1973-01-30 Expired JPS5548700B2 ( )

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1228573A JPS5548700B2 ( ) 1973-01-30 1973-01-30
US436801A US3908184A (en) 1973-01-30 1974-01-25 Ceramic substrate assembly for electronic circuits having ceramic films thereon for intercepting the flow of brazing agents

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1228573A JPS5548700B2 ( ) 1973-01-30 1973-01-30

Publications (2)

Publication Number Publication Date
JPS49100566A JPS49100566A ( ) 1974-09-24
JPS5548700B2 true JPS5548700B2 ( ) 1980-12-08

Family

ID=11801075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1228573A Expired JPS5548700B2 ( ) 1973-01-30 1973-01-30

Country Status (2)

Country Link
US (1) US3908184A ( )
JP (1) JPS5548700B2 ( )

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102251753B1 (ko) * 2020-07-24 2021-05-13 이제홍 치질 치료용 기구

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568499B2 ( ) * 1973-06-12 1981-02-24
DE2551956C3 (de) * 1975-11-19 1978-08-03 Heimann Gmbh, 6200 Wiesbaden Photoempfindliche Matrix mit einem Substrat
US4126882A (en) * 1976-08-02 1978-11-21 Texas Instruments Incorporated Package for multielement electro-optical devices
US4165474A (en) * 1977-12-27 1979-08-21 Texas Instruments Incorporated Optoelectronic displays using uniformly spaced arrays of semi-sphere light-emitting diodes
JPS54114758U ( ) * 1978-01-31 1979-08-11
US4241360A (en) * 1978-08-10 1980-12-23 Galileo Electro-Optics Corp. Series capacitor voltage multiplier circuit with top connected rectifiers
JPS55120152A (en) * 1979-03-09 1980-09-16 Fujitsu Ltd Semiconductor device
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
JPS5837173U (ja) * 1981-09-04 1983-03-10 クラリオン株式会社 プリント基板
JPS5858374U (ja) * 1981-10-14 1983-04-20 日本電気株式会社 印刷基板
JPS59169165A (ja) * 1983-03-16 1984-09-25 Hitachi Ltd 半導体装置
JPS6014494A (ja) * 1983-07-04 1985-01-25 株式会社日立製作所 セラミツク多層配線基板およびその製造方法
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
US4843280A (en) * 1988-01-15 1989-06-27 Siemens Corporate Research & Support, Inc. A modular surface mount component for an electrical device or led's
US4890383A (en) * 1988-01-15 1990-01-02 Simens Corporate Research & Support, Inc. Method for producing displays and modular components
US5196918A (en) * 1989-08-28 1993-03-23 Sumitomo Electric Industries, Ltd. Integrated circuit device and method for manufacturing the same
DE3929477A1 (de) * 1989-09-05 1991-03-07 Siemens Ag Led-anordnung
US5868884A (en) * 1994-03-25 1999-02-09 Sumitomo Metal Industries, Ltd. Method for producing ceramic dielectrics
US5831290A (en) * 1997-02-25 1998-11-03 Quarton, Inc. Laser diode mounting structure
US5977567A (en) * 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same
US6511236B1 (en) 1999-09-07 2003-01-28 Intel Corporation Optoelectronic assembly and method for fabricating the same
US6227724B1 (en) 1999-01-11 2001-05-08 Lightlogic, Inc. Method for constructing an optoelectronic assembly
US6207950B1 (en) 1999-01-11 2001-03-27 Lightlogic, Inc. Optical electronic assembly having a flexure for maintaining alignment between optical elements
US6585427B2 (en) 1999-01-11 2003-07-01 Intel Corporation Flexure coupled to a substrate for maintaining the optical fibers in alignment
JP3553405B2 (ja) * 1999-03-03 2004-08-11 ローム株式会社 チップ型電子部品
US6252726B1 (en) 1999-09-02 2001-06-26 Lightlogic, Inc. Dual-enclosure optoelectronic packages
DE10204200A1 (de) * 2002-02-01 2003-08-21 Conti Temic Microelectronic Leistungsmodul
WO2007061033A1 (ja) * 2005-11-28 2007-05-31 Sharp Kabushiki Kaisha 照明装置とその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3192307A (en) * 1964-05-29 1965-06-29 Burndy Corp Connector for component and printed circuit board
US3405224A (en) * 1966-04-20 1968-10-08 Nippon Electric Co Sealed enclosure for electronic device
US3555364A (en) * 1968-01-31 1971-01-12 Drexel Inst Of Technology Microelectronic modules and assemblies
US3748543A (en) * 1971-04-01 1973-07-24 Motorola Inc Hermetically sealed semiconductor package and method of manufacture
US3735211A (en) * 1971-06-21 1973-05-22 Fairchild Camera Instr Co Semiconductor package containing a dual epoxy and metal seal between a cover and a substrate, and method for forming said seal
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
JPS5118320B2 ( ) * 1972-03-01 1976-06-09
US3739232A (en) * 1972-04-10 1973-06-12 Northrop Corp Interconnected electrical circuit board assembly and method of fabrication

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102251753B1 (ko) * 2020-07-24 2021-05-13 이제홍 치질 치료용 기구

Also Published As

Publication number Publication date
JPS49100566A ( ) 1974-09-24
US3908184A (en) 1975-09-23

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