JPS5552244A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5552244A JPS5552244A JP12595678A JP12595678A JPS5552244A JP S5552244 A JPS5552244 A JP S5552244A JP 12595678 A JP12595678 A JP 12595678A JP 12595678 A JP12595678 A JP 12595678A JP S5552244 A JPS5552244 A JP S5552244A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- nickel
- cap
- koval
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 5
- 238000007789 sealing Methods 0.000 abstract 5
- 238000005253 cladding Methods 0.000 abstract 3
- 229910052759 nickel Inorganic materials 0.000 abstract 3
- 238000003466 welding Methods 0.000 abstract 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
Landscapes
- Gasket Seals (AREA)
Abstract
PURPOSE: To provide an airtight and highly anti-corrosive sealing device useful for semiconductor devices by use of a capping means comprising koval or the like metal as the mother material and nickel as the cladding material and by applying the capping means for sealing by seam welding.
CONSTITUTION: The desired cap for the sealing purpose being manufactured by the cladding processes is composed of an 0.05mm thick mother material 13 of koval or a 42 nickel-iron alloy and an 0.025mm thick cladding material 14 of nickel overlying each side of the mother material 13, the composite having a total thickness of 0.1mm, and being easily deformed into the desired shape, to be suited to sealing by seam welding. In the sealing performance, no cracking occurs to a container to be sealed despite the presence of differences in thermal expansion between the cap and a frame 6 of the container. The cap is dispensed with nickel plating and proved to have an excellent anti-corrosive property as a result of salt spray testing.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12595678A JPS5552244A (en) | 1978-10-12 | 1978-10-12 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12595678A JPS5552244A (en) | 1978-10-12 | 1978-10-12 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5552244A true JPS5552244A (en) | 1980-04-16 |
Family
ID=14923125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12595678A Pending JPS5552244A (en) | 1978-10-12 | 1978-10-12 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5552244A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039249U (en) * | 1983-08-24 | 1985-03-19 | 日本電気株式会社 | Semiconductor device with preferred metal cap |
-
1978
- 1978-10-12 JP JP12595678A patent/JPS5552244A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039249U (en) * | 1983-08-24 | 1985-03-19 | 日本電気株式会社 | Semiconductor device with preferred metal cap |
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