JPS5562192A - Partial plating method of blanked flat bar material - Google Patents
Partial plating method of blanked flat bar materialInfo
- Publication number
- JPS5562192A JPS5562192A JP13305878A JP13305878A JPS5562192A JP S5562192 A JPS5562192 A JP S5562192A JP 13305878 A JP13305878 A JP 13305878A JP 13305878 A JP13305878 A JP 13305878A JP S5562192 A JPS5562192 A JP S5562192A
- Authority
- JP
- Japan
- Prior art keywords
- flat bar
- plating
- bar material
- tapes
- blanked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract 8
- 238000007747 plating Methods 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 2
- 239000004698 Polyethylene Substances 0.000 abstract 3
- -1 polyethylene Polymers 0.000 abstract 3
- 229920000573 polyethylene Polymers 0.000 abstract 3
- 230000006835 compression Effects 0.000 abstract 2
- 238000007906 compression Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920000728 polyester Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
- Chemically Coating (AREA)
Abstract
PURPOSE: To make the plating boundaries of partially plated flat bar materials by masking the portions of the blanked flat bar materials not requiring plating with thermally fusible plastic tapes and applying plating.
CONSTITUTION: The both sides and cut end parts of the portions not requiring plating of a blanked copper flat bar material 11 or the like used for semiconductor lead frames or the like are covered with thermally fusible tapes 2 composed of polyester 12 and polyethylene 13 in such a manner that the polyethylene side 13 makes contact to the flat bar material 11. Next, the tapes are compression bonded under heating with hot compression bonding rollers or the like, whereby the material is masked. After the specified plating is applied to this masked flat bar material, hot air is applied to soften the polyethylene 13 of the tape 2 and the tapes 2 are peeled from both sides. This method yields the partially plated flat bar material of distinct plating boundaries up to the cut end parts and of high quality.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13305878A JPS5562192A (en) | 1978-10-27 | 1978-10-27 | Partial plating method of blanked flat bar material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13305878A JPS5562192A (en) | 1978-10-27 | 1978-10-27 | Partial plating method of blanked flat bar material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5562192A true JPS5562192A (en) | 1980-05-10 |
| JPS6124476B2 JPS6124476B2 (en) | 1986-06-11 |
Family
ID=15095832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13305878A Granted JPS5562192A (en) | 1978-10-27 | 1978-10-27 | Partial plating method of blanked flat bar material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5562192A (en) |
-
1978
- 1978-10-27 JP JP13305878A patent/JPS5562192A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6124476B2 (en) | 1986-06-11 |
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