JPS556408A - Vacuum evaporating apparatus - Google Patents

Vacuum evaporating apparatus

Info

Publication number
JPS556408A
JPS556408A JP7648778A JP7648778A JPS556408A JP S556408 A JPS556408 A JP S556408A JP 7648778 A JP7648778 A JP 7648778A JP 7648778 A JP7648778 A JP 7648778A JP S556408 A JPS556408 A JP S556408A
Authority
JP
Japan
Prior art keywords
alloy
source
electron beam
molten
evaporative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7648778A
Other languages
Japanese (ja)
Other versions
JPS6013067B2 (en
Inventor
Keiji Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7648778A priority Critical patent/JPS6013067B2/en
Publication of JPS556408A publication Critical patent/JPS556408A/en
Publication of JPS6013067B2 publication Critical patent/JPS6013067B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To obtain the evaporation of alloy with uniform composition, by installing the auxiliary heater nearby the cruicible on purpose to place whole evaporative source under the molten condition, at the electron beam vacuum evaporating apparatus. CONSTITUTION:The alloy evaporative source 12 is put in the conductive cruicible 11, and is induction heated by the high frequency coil 14 installed in the outer surface of the bell jar 2, and is placed under wholly molten condition. The electron beam 8 is generated by impressing high voltage supplied from the high voltage source 7, and is projected on the molten alloy 12. Hereby, the molten alloy 12 vaporizes, and evaporates on the surface of the semiconductor wafer 10. According to this method, since the evaporative source alloy 12 is previously placed under the molten condition, the alloy evaporation of uniform composition can be executed. Moreover, the bumping phenomenon of metal, being apt to happen when heating by the electron beam, does not happen. Furthermore, the output of electron beam can be weaker as compared with the conventional method in which the solid evaporative source is vaporized; as a result, the life of the electron rays source can be extended.
JP7648778A 1978-06-26 1978-06-26 Vacuum deposition equipment Expired JPS6013067B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7648778A JPS6013067B2 (en) 1978-06-26 1978-06-26 Vacuum deposition equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7648778A JPS6013067B2 (en) 1978-06-26 1978-06-26 Vacuum deposition equipment

Publications (2)

Publication Number Publication Date
JPS556408A true JPS556408A (en) 1980-01-17
JPS6013067B2 JPS6013067B2 (en) 1985-04-04

Family

ID=13606563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7648778A Expired JPS6013067B2 (en) 1978-06-26 1978-06-26 Vacuum deposition equipment

Country Status (1)

Country Link
JP (1) JPS6013067B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627261U (en) * 1985-06-29 1987-01-17
JPS627273U (en) * 1985-06-29 1987-01-17
JPS6377569U (en) * 1986-11-12 1988-05-23

Also Published As

Publication number Publication date
JPS6013067B2 (en) 1985-04-04

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