JPS5565355A - Nonelectrolytic copper deposition having rapid plating velocity - Google Patents

Nonelectrolytic copper deposition having rapid plating velocity

Info

Publication number
JPS5565355A
JPS5565355A JP11865179A JP11865179A JPS5565355A JP S5565355 A JPS5565355 A JP S5565355A JP 11865179 A JP11865179 A JP 11865179A JP 11865179 A JP11865179 A JP 11865179A JP S5565355 A JPS5565355 A JP S5565355A
Authority
JP
Japan
Prior art keywords
copper deposition
rapid plating
nonelectrolytic copper
plating velocity
velocity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11865179A
Other languages
English (en)
Other versions
JPS5927379B2 (ja
Inventor
Efu Matsukoomatsuku Jiyon
Jiei Natsuchi Furanshisu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of JPS5565355A publication Critical patent/JPS5565355A/ja
Publication of JPS5927379B2 publication Critical patent/JPS5927379B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP54118651A 1978-09-13 1979-09-13 迅速なメツキ速度を有する無電解銅折出法 Expired JPS5927379B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94191278A 1978-09-13 1978-09-13
US000000941912 1978-09-13

Publications (2)

Publication Number Publication Date
JPS5565355A true JPS5565355A (en) 1980-05-16
JPS5927379B2 JPS5927379B2 (ja) 1984-07-05

Family

ID=25477278

Family Applications (2)

Application Number Title Priority Date Filing Date
JP54118651A Expired JPS5927379B2 (ja) 1978-09-13 1979-09-13 迅速なメツキ速度を有する無電解銅折出法
JP58112590A Expired JPS5915981B2 (ja) 1978-09-13 1983-06-21 迅速なメツキ速度を有する無電解銅析出法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP58112590A Expired JPS5915981B2 (ja) 1978-09-13 1983-06-21 迅速なメツキ速度を有する無電解銅析出法

Country Status (17)

Country Link
JP (2) JPS5927379B2 (ja)
AT (1) AT366105B (ja)
AU (1) AU532144B2 (ja)
BR (1) BR7905066A (ja)
CA (1) CA1135903A (ja)
CH (1) CH646200A5 (ja)
DE (1) DE2937297C2 (ja)
DK (1) DK148920C (ja)
ES (1) ES484158A1 (ja)
FR (1) FR2436192A1 (ja)
GB (1) GB2032462B (ja)
IL (1) IL58202A (ja)
IT (1) IT1162420B (ja)
MX (1) MX152657A (ja)
NL (1) NL189523C (ja)
SE (1) SE7907531L (ja)
ZA (1) ZA793786B (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241188A (ja) * 1986-11-14 1988-10-06 Nippon Denso Co Ltd 化学銅めっき液
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
JPH036383A (ja) * 1989-06-02 1991-01-11 Nippondenso Co Ltd 化学銅めっき液
JP2013095956A (ja) * 2011-10-31 2013-05-20 Shinko Electric Ind Co Ltd 無電解銅めっき浴
JP2019218629A (ja) * 2018-06-15 2019-12-26 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 無電解銅めっき用組成物および基材上に銅を無電解めっきするための方法
JP2023539602A (ja) * 2020-08-27 2023-09-15 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8005024A (nl) * 1980-09-05 1982-04-01 Philips Nv Werkwijze voor de vervaardiging van koperlegeringslagen en -patronen op substraten en de aldus vervaardigde produkten.
DE3585017D1 (de) * 1984-09-27 1992-02-06 Toshiba Kawasaki Kk Stromlose kupferplattierloesung.
ES2039403T3 (es) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) Metodo para depositar sin electricidad cobre de alta calidad.
JPH0723539B2 (ja) * 1986-11-06 1995-03-15 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2595319B2 (ja) * 1988-07-20 1997-04-02 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
JPH0448100A (ja) * 1990-06-15 1992-02-18 Nkk Corp 洗浄設備
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
JP5255015B2 (ja) * 2010-04-28 2013-08-07 名古屋メッキ工業株式会社 高分子繊維の無電解銅めっき方法
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
CN113881984B (zh) * 2021-10-21 2022-09-16 深圳市励高表面处理材料有限公司 一种脉冲电镀整平剂及制备方法和应用该整平液的电镀液
CN117385348A (zh) * 2023-09-11 2024-01-12 广东利尔化学有限公司 一种沉铜液以及稳定剂

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
CH491206A (de) * 1966-02-01 1970-05-31 Photocircuits Corp Badlösung zum stromlosen Abscheiden von Metallschichten
US3720525A (en) * 1971-08-16 1973-03-13 Rca Corp Electroless copper plating solutions with accelerated plating rates
US3708329A (en) * 1971-09-10 1973-01-02 Bell Telephone Labor Inc Electroless copper plating
US3915718A (en) * 1972-10-04 1975-10-28 Schering Ag Chemical silver bath
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
JPS5173933A (ja) * 1974-12-25 1976-06-26 Mitsubishi Rayon Co Mudenkaidometsukyoku
JPS5746448B2 (ja) * 1975-03-14 1982-10-04
JPS5288227A (en) * 1976-01-19 1977-07-23 Hitachi Ltd Chemical copper plating solution
IT1059950B (it) * 1976-04-30 1982-06-21 Alfachimici Spa Composizione per la ramatura anelettrica autocatalitica
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241188A (ja) * 1986-11-14 1988-10-06 Nippon Denso Co Ltd 化学銅めっき液
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
JPH036383A (ja) * 1989-06-02 1991-01-11 Nippondenso Co Ltd 化学銅めっき液
JP2013095956A (ja) * 2011-10-31 2013-05-20 Shinko Electric Ind Co Ltd 無電解銅めっき浴
JP2019218629A (ja) * 2018-06-15 2019-12-26 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 無電解銅めっき用組成物および基材上に銅を無電解めっきするための方法
JP2023539602A (ja) * 2020-08-27 2023-09-15 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法

Also Published As

Publication number Publication date
NL189523C (nl) 1993-05-03
ES484158A1 (es) 1980-09-01
FR2436192B1 (ja) 1983-08-26
BR7905066A (pt) 1980-04-29
NL7906856A (nl) 1980-03-17
CH646200A5 (de) 1984-11-15
CA1135903A (en) 1982-11-23
IT1162420B (it) 1987-04-01
DE2937297A1 (de) 1980-03-20
MX152657A (es) 1985-10-07
GB2032462A (en) 1980-05-08
DK381979A (da) 1980-03-14
IT7950227A0 (it) 1979-09-11
ATA600879A (de) 1981-07-15
DK148920B (da) 1985-11-18
AT366105B (de) 1982-03-10
IL58202A0 (en) 1979-12-30
AU4956779A (en) 1980-03-20
JPS5925965A (ja) 1984-02-10
DK148920C (da) 1986-05-05
ZA793786B (en) 1980-07-30
IL58202A (en) 1982-08-31
AU532144B2 (en) 1983-09-22
SE7907531L (sv) 1980-03-14
JPS5927379B2 (ja) 1984-07-05
JPS5915981B2 (ja) 1984-04-12
FR2436192A1 (fr) 1980-04-11
DE2937297C2 (de) 1982-04-08
GB2032462B (en) 1983-05-18

Similar Documents

Publication Publication Date Title
GB2037327B (en) Electroless copper deposition
JPS54153737A (en) Nonelectrolytic copper plating composition
JPS54121233A (en) Electroless copper plating method
GB2093485B (en) Electroless alloy plating
JPS5565355A (en) Nonelectrolytic copper deposition having rapid plating velocity
GB2095292B (en) Electroless gold plating
JPS5547391A (en) Multilayer plating
DE3367940D1 (en) Electroless copper deposition solution
DE3066952D1 (en) Electroless copper plating solution
GB2068416B (en) Mechanical plating
AU536421B2 (en) Electrodialytically regenerating electroless plating bath
GB2034756B (en) Electroless deposition of transition metals
JPS5534699A (en) Silver plating
AU509685B2 (en) Electroless Copper Plating
JPS5582793A (en) Nickelliron plating method
JPS56150176A (en) Metal electroless deposition
GB8414641D0 (en) High speed silver plating
JPS54117329A (en) Electroless plating method
JPS54124834A (en) Partly electroless plating method
GB2098240B (en) Forming articles by plating
JPS54112340A (en) Electroless plating method
JPS5285935A (en) Peeling solution for copper plating
JPS5517525A (en) Substrate for nonnelectrolysis plating
JPS5574198A (en) Throughhhole plating process
JPS5291739A (en) Nonnelectrolytic copper plating solution