JPS5567134A - Method for manufacturing electrode of semiconductor device - Google Patents

Method for manufacturing electrode of semiconductor device

Info

Publication number
JPS5567134A
JPS5567134A JP14080278A JP14080278A JPS5567134A JP S5567134 A JPS5567134 A JP S5567134A JP 14080278 A JP14080278 A JP 14080278A JP 14080278 A JP14080278 A JP 14080278A JP S5567134 A JPS5567134 A JP S5567134A
Authority
JP
Japan
Prior art keywords
film
sio
mask
thin
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14080278A
Other languages
Japanese (ja)
Inventor
Nobuo Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akai Electric Co Ltd
Original Assignee
Akai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akai Electric Co Ltd filed Critical Akai Electric Co Ltd
Priority to JP14080278A priority Critical patent/JPS5567134A/en
Publication of JPS5567134A publication Critical patent/JPS5567134A/en
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To manufacture an electrode without exerting an influence upon a semiconductor device, by laminating an SiO2 film and a thin Al film on a semiconductor substrate which has an element region, firstly etching the thin Al film with a mask of a photoresist film which has an electrode hole, and secondly etching the SiO2 film with a mask of the thin Al film.
CONSTITUTION: An SiO2 film and a thin Al film 14 are coated on a semiconductor substrate 11 which has a pn-type region 12. The film 14 is covered with a photoresist film 15 provided with an electrode hole 16 facing the region 12. The photoresist film 15 is used as a mask to etch the film 14 exposed to the electrode hole 16 to open another hole 16 through the film 14 as well. The film 15 is removed. The film 14 having the hole 16 is used as a mask to perform etching to open still another hole 16 through the film 13 and expose the region 12. Al electrodes 17 are attached to a p-type and an n-type regions provided in the area 12. The SiO2 film 13 is coated on the area 12 between the regions.
COPYRIGHT: (C)1980,JPO&Japio
JP14080278A 1978-11-14 1978-11-14 Method for manufacturing electrode of semiconductor device Pending JPS5567134A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14080278A JPS5567134A (en) 1978-11-14 1978-11-14 Method for manufacturing electrode of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14080278A JPS5567134A (en) 1978-11-14 1978-11-14 Method for manufacturing electrode of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5567134A true JPS5567134A (en) 1980-05-21

Family

ID=15277070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14080278A Pending JPS5567134A (en) 1978-11-14 1978-11-14 Method for manufacturing electrode of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5567134A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839338A (en) * 1971-09-27 1973-06-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839338A (en) * 1971-09-27 1973-06-09

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