JPS556805A - Method of producing semiconductor - Google Patents

Method of producing semiconductor

Info

Publication number
JPS556805A
JPS556805A JP7801078A JP7801078A JPS556805A JP S556805 A JPS556805 A JP S556805A JP 7801078 A JP7801078 A JP 7801078A JP 7801078 A JP7801078 A JP 7801078A JP S556805 A JPS556805 A JP S556805A
Authority
JP
Japan
Prior art keywords
glass layer
groove
layer
substrate
baking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7801078A
Other languages
English (en)
Inventor
Nobutami Oka
Masafumi Miyagawa
Tsuneo Atsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7801078A priority Critical patent/JPS556805A/ja
Publication of JPS556805A publication Critical patent/JPS556805A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/134—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being in grooves in the semiconductor body

Landscapes

  • Formation Of Insulating Films (AREA)
JP7801078A 1978-06-29 1978-06-29 Method of producing semiconductor Pending JPS556805A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7801078A JPS556805A (en) 1978-06-29 1978-06-29 Method of producing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7801078A JPS556805A (en) 1978-06-29 1978-06-29 Method of producing semiconductor

Publications (1)

Publication Number Publication Date
JPS556805A true JPS556805A (en) 1980-01-18

Family

ID=13649809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7801078A Pending JPS556805A (en) 1978-06-29 1978-06-29 Method of producing semiconductor

Country Status (1)

Country Link
JP (1) JPS556805A (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330871A (en) * 1990-11-29 1994-07-19 Canon Kabushiki Kaisha Toner for developing electrostatic image
US5364720A (en) * 1992-10-15 1994-11-15 Canon Kabushiki Kaisha Magnetic developer for developing electrostatic images
EP0686882A1 (en) 1994-05-13 1995-12-13 Canon Kabushiki Kaisha Toner for developing electrostatic images, process cartridge, and image forming method
US5972553A (en) * 1995-10-30 1999-10-26 Canon Kabushiki Kaisha Toner for developing electrostatic image, process-cartridge and image forming method
US6002895A (en) * 1994-05-13 1999-12-14 Canon Kabushiki Kaisha Process cartridge
US6808852B2 (en) 2001-09-06 2004-10-26 Canon Kabushiki Kaisha Toner and heat-fixing method
JP2011192662A (ja) * 2010-03-03 2011-09-29 Napura:Kk 電子デバイス用基板及び電子デバイス
US8415784B2 (en) 2009-06-02 2013-04-09 Napra Co., Ltd. Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
KR20210110694A (ko) * 2019-02-15 2021-09-08 산둥 차이쥐 일렉트로닉 테크놀로지 컴퍼니 리미티드 웨이퍼로의 유리 분말 충진 장치

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500318A (en) * 1990-11-29 1996-03-19 Canon Kabushiki Kaisha Toner for developing electrostatic image and fixing method
US5330871A (en) * 1990-11-29 1994-07-19 Canon Kabushiki Kaisha Toner for developing electrostatic image
US5364720A (en) * 1992-10-15 1994-11-15 Canon Kabushiki Kaisha Magnetic developer for developing electrostatic images
US6002895A (en) * 1994-05-13 1999-12-14 Canon Kabushiki Kaisha Process cartridge
US5736288A (en) * 1994-05-13 1998-04-07 Canon Kabushiki Kaisha Toner for developing electrostatic images, process cartridge, and image forming method
EP0686882A1 (en) 1994-05-13 1995-12-13 Canon Kabushiki Kaisha Toner for developing electrostatic images, process cartridge, and image forming method
US5972553A (en) * 1995-10-30 1999-10-26 Canon Kabushiki Kaisha Toner for developing electrostatic image, process-cartridge and image forming method
US6808852B2 (en) 2001-09-06 2004-10-26 Canon Kabushiki Kaisha Toner and heat-fixing method
US8415784B2 (en) 2009-06-02 2013-04-09 Napra Co., Ltd. Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
US8759211B2 (en) 2009-06-02 2014-06-24 Napra Co., Ltd. Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
JP2011192662A (ja) * 2010-03-03 2011-09-29 Napura:Kk 電子デバイス用基板及び電子デバイス
KR20210110694A (ko) * 2019-02-15 2021-09-08 산둥 차이쥐 일렉트로닉 테크놀로지 컴퍼니 리미티드 웨이퍼로의 유리 분말 충진 장치
JP2022517437A (ja) * 2019-02-15 2022-03-08 シャンドン ツァイジュー エレクトロニック テクノロジー カンパニー リミテッド ウェハにガラス粉末を充填する装置
JP2022116078A (ja) * 2019-02-15 2022-08-09 シャンドン ツァイジュー エレクトロニック テクノロジー カンパニー リミテッド ウェハにガラス粉末を充填する装置

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