JPS556862A - Mounting structure of ic for electronic timepiece - Google Patents

Mounting structure of ic for electronic timepiece

Info

Publication number
JPS556862A
JPS556862A JP7934378A JP7934378A JPS556862A JP S556862 A JPS556862 A JP S556862A JP 7934378 A JP7934378 A JP 7934378A JP 7934378 A JP7934378 A JP 7934378A JP S556862 A JPS556862 A JP S556862A
Authority
JP
Japan
Prior art keywords
tin
gold
inner lead
mounting structure
electronic timepiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7934378A
Other languages
Japanese (ja)
Inventor
Katsuhiko Hirasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP7934378A priority Critical patent/JPS556862A/en
Publication of JPS556862A publication Critical patent/JPS556862A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To improve reliability as mounting for a timepiece, by plating only an inner lead portion and its vicinity of a film substrate with tin, and by gilding other portions with gold.
CONSTITUTION: An inner lead 12a or a conductive pattern 12b on a film substrate 11 in 0.4W1.0mm toward the outside from a device hole 26 and an IC 16 plated with tin with thickness optimum for gold-tin bonding are gold-tin bonded by a gold valve 15 and the inner lead 12a. This structure is sealed with resin 17 so as to cover a range of tin plating 13 after bonding.
COPYRIGHT: (C)1980,JPO&Japio
JP7934378A 1978-06-29 1978-06-29 Mounting structure of ic for electronic timepiece Pending JPS556862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7934378A JPS556862A (en) 1978-06-29 1978-06-29 Mounting structure of ic for electronic timepiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7934378A JPS556862A (en) 1978-06-29 1978-06-29 Mounting structure of ic for electronic timepiece

Publications (1)

Publication Number Publication Date
JPS556862A true JPS556862A (en) 1980-01-18

Family

ID=13687248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7934378A Pending JPS556862A (en) 1978-06-29 1978-06-29 Mounting structure of ic for electronic timepiece

Country Status (1)

Country Link
JP (1) JPS556862A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196840A (en) * 1986-02-24 1987-08-31 Oki Electric Ind Co Ltd Film carrier tape
JPH02209742A (en) * 1988-09-16 1990-08-21 Natl Semiconductor Corp <Ns> Gold/tin entectic bonding for tape automaization bonding process
JPH05267546A (en) * 1992-05-11 1993-10-15 Kyushu Hitachi Maxell Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196840A (en) * 1986-02-24 1987-08-31 Oki Electric Ind Co Ltd Film carrier tape
JPH02209742A (en) * 1988-09-16 1990-08-21 Natl Semiconductor Corp <Ns> Gold/tin entectic bonding for tape automaization bonding process
JPH05267546A (en) * 1992-05-11 1993-10-15 Kyushu Hitachi Maxell Ltd Semiconductor device

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