JPS572548A - Ic electrode structure - Google Patents

Ic electrode structure

Info

Publication number
JPS572548A
JPS572548A JP7620980A JP7620980A JPS572548A JP S572548 A JPS572548 A JP S572548A JP 7620980 A JP7620980 A JP 7620980A JP 7620980 A JP7620980 A JP 7620980A JP S572548 A JPS572548 A JP S572548A
Authority
JP
Japan
Prior art keywords
residue
passivation
bonding
bump
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7620980A
Other languages
Japanese (ja)
Inventor
Kazuo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP7620980A priority Critical patent/JPS572548A/en
Publication of JPS572548A publication Critical patent/JPS572548A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform a mini MOD mounting with high bonding yield and high reliability by forming a passivation residue in an aluminum electrode of an IC upon formation of a periphery protective film and bonding a bump through the residue. CONSTITUTION:An aluminum electrode 1 is formed on the surface of the substrate 2 of an IC. The outer periphery of the electrode is covered with a passivation film 3 made of an SiO2, but an insular or lattice-shaped passivation residue 10 is formed in the hole 3a of the passivation upon formation of the film 3. After a Cr layer 4' and the second metallic layer 5' are covered over the aluminum electrode and the residue, an Au plating layer 6' is formed to become a bump of mini MOD mounting. Thus, the stepwise difference on the bonding surface of the bump can be eliminated to improve the yield of the bonding and to perform the mini MOD mounting with high reliability.
JP7620980A 1980-06-06 1980-06-06 Ic electrode structure Pending JPS572548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7620980A JPS572548A (en) 1980-06-06 1980-06-06 Ic electrode structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7620980A JPS572548A (en) 1980-06-06 1980-06-06 Ic electrode structure

Publications (1)

Publication Number Publication Date
JPS572548A true JPS572548A (en) 1982-01-07

Family

ID=13598772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7620980A Pending JPS572548A (en) 1980-06-06 1980-06-06 Ic electrode structure

Country Status (1)

Country Link
JP (1) JPS572548A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117135A (en) * 1982-12-24 1984-07-06 Hitachi Ltd Semiconductor device and manufacture of the same
JP2008016549A (en) * 2006-07-04 2008-01-24 Tdk Corp Electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117135A (en) * 1982-12-24 1984-07-06 Hitachi Ltd Semiconductor device and manufacture of the same
JP2008016549A (en) * 2006-07-04 2008-01-24 Tdk Corp Electronic components

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