JPS5568668A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5568668A JPS5568668A JP14303778A JP14303778A JPS5568668A JP S5568668 A JPS5568668 A JP S5568668A JP 14303778 A JP14303778 A JP 14303778A JP 14303778 A JP14303778 A JP 14303778A JP S5568668 A JPS5568668 A JP S5568668A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- peripheral edge
- blocks
- improper
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/10—Integrated device layouts
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
PURPOSE:To enhance the utility efficiency of a circular semiconductor wafer by setting improper portions occurred at the peripheral edge of the wafer at complementary relation when mounting a plurality of blocks having circuit function such as transistors or the like on a bearer by dividing them into two or four segments equally after providing the blocks even on the peripheral edge of the wafer when forming the blocks on the wafer. CONSTITUTION:When a plurality of circuit blocks A each having transistor, resistors and capacitors as circuit functions are formed on a circular semiconductor wafer, a circuit block A improper even in shape is also formed on the peripheral edge of the wafer to be normally abandoned. When the wafer is then divided into two or four segments and the divided wafers B, C are mounted on a bearer 1, the improper circuits A are so arranged and connected to become complementary relation among the divided wafers. Thus, the peripheral edge of the wafer may be used to thereby improve the utility efficiency of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14303778A JPS5568668A (en) | 1978-11-20 | 1978-11-20 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14303778A JPS5568668A (en) | 1978-11-20 | 1978-11-20 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5568668A true JPS5568668A (en) | 1980-05-23 |
| JPS6226186B2 JPS6226186B2 (en) | 1987-06-08 |
Family
ID=15329427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14303778A Granted JPS5568668A (en) | 1978-11-20 | 1978-11-20 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5568668A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5016080A (en) * | 1988-10-07 | 1991-05-14 | Exar Corporation | Programmable die size continuous array |
| US5138419A (en) * | 1988-06-01 | 1992-08-11 | Fujitsu Limited | Wafer scale integration device with dummy chips and relay pads |
-
1978
- 1978-11-20 JP JP14303778A patent/JPS5568668A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5138419A (en) * | 1988-06-01 | 1992-08-11 | Fujitsu Limited | Wafer scale integration device with dummy chips and relay pads |
| US5016080A (en) * | 1988-10-07 | 1991-05-14 | Exar Corporation | Programmable die size continuous array |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6226186B2 (en) | 1987-06-08 |
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