JPS5572029A - Tray for semiconductor wafer - Google Patents

Tray for semiconductor wafer

Info

Publication number
JPS5572029A
JPS5572029A JP14618178A JP14618178A JPS5572029A JP S5572029 A JPS5572029 A JP S5572029A JP 14618178 A JP14618178 A JP 14618178A JP 14618178 A JP14618178 A JP 14618178A JP S5572029 A JPS5572029 A JP S5572029A
Authority
JP
Japan
Prior art keywords
tray
wafers
semiconductor wafer
vacuum chuck
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14618178A
Other languages
Japanese (ja)
Inventor
Hideo Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14618178A priority Critical patent/JPS5572029A/en
Publication of JPS5572029A publication Critical patent/JPS5572029A/en
Pending legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To facilitate vacuum chuck type attach/detach operation by making numbers of throughholes on a tray where wafers are mounted.
CONSTITUTION: Air vent holes 14 are provided on the surface of a tray where wafers drop from the vacuum chuck. This allows air left between the tray and wafers to be readily removed through the holes 14. The wafers are prevented from sliding on the surface and therefore easy to be positioned. When the wafer needs to be sucked, air easily moved between the wafer and tray thereby facilitating the operation.
COPYRIGHT: (C)1980,JPO&Japio
JP14618178A 1978-11-27 1978-11-27 Tray for semiconductor wafer Pending JPS5572029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14618178A JPS5572029A (en) 1978-11-27 1978-11-27 Tray for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14618178A JPS5572029A (en) 1978-11-27 1978-11-27 Tray for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5572029A true JPS5572029A (en) 1980-05-30

Family

ID=15401958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14618178A Pending JPS5572029A (en) 1978-11-27 1978-11-27 Tray for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5572029A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183666U (en) * 1981-05-18 1982-11-20
JPS5881934U (en) * 1981-11-30 1983-06-03 株式会社日立製作所 Automatic continuous baking oven
JPS5922340A (en) * 1982-07-29 1984-02-04 Toshiba Corp Electrostatic chucking device
JPS59189643A (en) * 1983-04-13 1984-10-27 Fujitsu Ltd In-line-type treatment device
JPH05166916A (en) * 1991-05-15 1993-07-02 Applied Materials Inc Method and apparatus for cooling a wafer
JP2002057209A (en) * 2000-06-01 2002-02-22 Tokyo Electron Ltd Single wafer processing apparatus and single wafer processing method
US6926937B2 (en) 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
US7108899B2 (en) 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5269578A (en) * 1975-12-08 1977-06-09 Hitachi Ltd Wafer suscepter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5269578A (en) * 1975-12-08 1977-06-09 Hitachi Ltd Wafer suscepter

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183666U (en) * 1981-05-18 1982-11-20
JPS5881934U (en) * 1981-11-30 1983-06-03 株式会社日立製作所 Automatic continuous baking oven
JPS5922340A (en) * 1982-07-29 1984-02-04 Toshiba Corp Electrostatic chucking device
JPS59189643A (en) * 1983-04-13 1984-10-27 Fujitsu Ltd In-line-type treatment device
JPH05166916A (en) * 1991-05-15 1993-07-02 Applied Materials Inc Method and apparatus for cooling a wafer
JP2002057209A (en) * 2000-06-01 2002-02-22 Tokyo Electron Ltd Single wafer processing apparatus and single wafer processing method
US6926937B2 (en) 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
US7108899B2 (en) 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface

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