JPS557824A - Adhesive for printed circuit board - Google Patents
Adhesive for printed circuit boardInfo
- Publication number
- JPS557824A JPS557824A JP7924878A JP7924878A JPS557824A JP S557824 A JPS557824 A JP S557824A JP 7924878 A JP7924878 A JP 7924878A JP 7924878 A JP7924878 A JP 7924878A JP S557824 A JPS557824 A JP S557824A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- butadiene polymer
- circuit board
- printed circuit
- essential component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract 3
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 abstract 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 2
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The title adhesive having low water absorption, excellent soldering resistance, electrical properties, etc., suitable for the adhesion of an electrical conductive material such as copper foil, etc. to a plastic insulating substate, and containing a cyclized butadiene polymer as an essential component.
CONSTITUTION: An adhesive composition comprising (A) a cyclized butadiene polymer as an essential component, and if necessary, (B) an organic solvent such as toluene, etc., (C) a curing catalyst such as cyclohexanone peroxide, etc., (D) a polymerizable monomer such as styrene, etc. The molecular weight of the butadiene polymer of the (A) component is pref. 2,000W1,000,000.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7924878A JPS557824A (en) | 1978-07-01 | 1978-07-01 | Adhesive for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7924878A JPS557824A (en) | 1978-07-01 | 1978-07-01 | Adhesive for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS557824A true JPS557824A (en) | 1980-01-21 |
Family
ID=13684548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7924878A Pending JPS557824A (en) | 1978-07-01 | 1978-07-01 | Adhesive for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS557824A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1084338C (en) * | 1997-06-27 | 2002-05-08 | 中国科学院长春应用化学研究所 | Method for Synthesizing Soluble Cyclopolydienes Catalyzed by Rare Earth |
-
1978
- 1978-07-01 JP JP7924878A patent/JPS557824A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1084338C (en) * | 1997-06-27 | 2002-05-08 | 中国科学院长春应用化学研究所 | Method for Synthesizing Soluble Cyclopolydienes Catalyzed by Rare Earth |
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