JPS5578534A - Pressure-contact type semiconductor device - Google Patents
Pressure-contact type semiconductor deviceInfo
- Publication number
- JPS5578534A JPS5578534A JP15224678A JP15224678A JPS5578534A JP S5578534 A JPS5578534 A JP S5578534A JP 15224678 A JP15224678 A JP 15224678A JP 15224678 A JP15224678 A JP 15224678A JP S5578534 A JPS5578534 A JP S5578534A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- plate
- outer periphery
- cut
- harder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To prevent plastic deformation and to minimize friction force by arranging a metal harder than a main electrode conductor in a cut provided on the outer periphery of a contact zone with a thermal compensation plate working as one electrode of a semiconductor element.
CONSTITUTION: A thermal compensation plate 3 to work as electrode is provided on one side of a semiconductor element, and an anode conductor 6 is provided on the plate 3. Then, a cut 12 is provided on the overall outer periphery on the conductor 6 side of a contact zone of the plate 3 with the conductor 6, and a metallic ring 13 of molybdenum, tungsten, titanium, rhodium, chrome, etc. which is harder than copper constituting the conductor 6 is arranged in the cut 12. According to this constitution, the ring 13 and the plate 3 are easy to slide with each other even when a presoure applied to the direction P indicated by an arrow is small, the outer periphery of an end of the conductor 6 is prevented from drooping through plastic deformation as the ring 13 is harder than the conductor 6, and thus curvatures of the conductor 6 and the plate 3 are reduced to zero to secure contact entirely through the whole surface by compression.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15224678A JPS5578534A (en) | 1978-12-08 | 1978-12-08 | Pressure-contact type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15224678A JPS5578534A (en) | 1978-12-08 | 1978-12-08 | Pressure-contact type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5578534A true JPS5578534A (en) | 1980-06-13 |
Family
ID=15536284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15224678A Pending JPS5578534A (en) | 1978-12-08 | 1978-12-08 | Pressure-contact type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5578534A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6235527A (en) * | 1985-08-08 | 1987-02-16 | Mitsubishi Electric Corp | Semiconductor device |
| JP2013160542A (en) * | 2012-02-02 | 2013-08-19 | Honda Motor Co Ltd | Inspection method and inspection apparatus for semiconductor chip |
-
1978
- 1978-12-08 JP JP15224678A patent/JPS5578534A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6235527A (en) * | 1985-08-08 | 1987-02-16 | Mitsubishi Electric Corp | Semiconductor device |
| JP2013160542A (en) * | 2012-02-02 | 2013-08-19 | Honda Motor Co Ltd | Inspection method and inspection apparatus for semiconductor chip |
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