JPS5578536A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5578536A
JPS5578536A JP15224978A JP15224978A JPS5578536A JP S5578536 A JPS5578536 A JP S5578536A JP 15224978 A JP15224978 A JP 15224978A JP 15224978 A JP15224978 A JP 15224978A JP S5578536 A JPS5578536 A JP S5578536A
Authority
JP
Japan
Prior art keywords
solder
electrode
lead
silver
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15224978A
Other languages
Japanese (ja)
Inventor
Toshiyuki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15224978A priority Critical patent/JPS5578536A/en
Publication of JPS5578536A publication Critical patent/JPS5578536A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07536—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain a satisfactory connection strength through a fluidization of a solder to the connection by heating and connecting an electrode of semiconductor pellet with a lead for external connection using of a metallic conducting wire with the solder applied evenly on the surface.
CONSTITUTION: A solder-clad wire is that for which the outer periphery of an electric good conductor like copper, nickel or silver which is 0.05W0.5mm diameter is covered evenly with the solder 0.01W0.5mm thick having a weight composition of tin 10%, lead 90% or tin 10%, silver 2%, lead 88% or indium 5%, silver 2.5%, lead 92.5%. The wire is heated and connected to a cathode electrode 3 and the tip of a cathode lead 7 in the method generally known. According to this constitution, each electrode is wetted entirely with the solder by surface tension of the solder and a metallized layer in the cathode electrode 3 and gate electrode 4, thus forming an electrode structure satisfactory in swelling on the electrode.
COPYRIGHT: (C)1980,JPO&Japio
JP15224978A 1978-12-08 1978-12-08 Semiconductor device Pending JPS5578536A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15224978A JPS5578536A (en) 1978-12-08 1978-12-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15224978A JPS5578536A (en) 1978-12-08 1978-12-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5578536A true JPS5578536A (en) 1980-06-13

Family

ID=15536348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15224978A Pending JPS5578536A (en) 1978-12-08 1978-12-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5578536A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504849A (en) * 1981-07-31 1985-03-12 U.S. Philips Corporation Semiconductor devices and a solder for use in such devices
DE102005034485A1 (en) * 2005-07-20 2007-02-01 Infineon Technologies Ag Connecting element for a semiconductor component and method for its production
EP2159834A1 (en) * 2009-09-01 2010-03-03 ABB Technology AG Conductive bond wire coating
US7709938B2 (en) 2005-06-22 2010-05-04 Infineon Technologies Ag Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504849A (en) * 1981-07-31 1985-03-12 U.S. Philips Corporation Semiconductor devices and a solder for use in such devices
US7709938B2 (en) 2005-06-22 2010-05-04 Infineon Technologies Ag Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
US8030744B2 (en) 2005-06-22 2011-10-04 Infineon Technologies Ag Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
DE102005028951B4 (en) 2005-06-22 2018-05-30 Infineon Technologies Ag Arrangement for the electrical connection of a semiconductor circuit arrangement with an external contact device
DE102005034485A1 (en) * 2005-07-20 2007-02-01 Infineon Technologies Ag Connecting element for a semiconductor component and method for its production
DE102005034485B4 (en) * 2005-07-20 2013-08-29 Infineon Technologies Ag Connecting element for a semiconductor device and method for producing a semiconductor power device
US8581371B2 (en) 2005-07-20 2013-11-12 Infineon Technologies Ag Connection element for a semiconductor component and method for producing the same
EP2159834A1 (en) * 2009-09-01 2010-03-03 ABB Technology AG Conductive bond wire coating

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