JPS5578552A - Semiconductor - Google Patents

Semiconductor

Info

Publication number
JPS5578552A
JPS5578552A JP15245878A JP15245878A JPS5578552A JP S5578552 A JPS5578552 A JP S5578552A JP 15245878 A JP15245878 A JP 15245878A JP 15245878 A JP15245878 A JP 15245878A JP S5578552 A JPS5578552 A JP S5578552A
Authority
JP
Japan
Prior art keywords
container
base
collar
projection
weld
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15245878A
Other languages
Japanese (ja)
Other versions
JPS5854504B2 (en
Inventor
Hiroyuki Fujii
Kenichi Tateno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP53152458A priority Critical patent/JPS5854504B2/en
Publication of JPS5578552A publication Critical patent/JPS5578552A/en
Publication of JPS5854504B2 publication Critical patent/JPS5854504B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide a ringed projection in a ringed portion to be welded to a metallic container for enclosing a stem for power semiconductor made of a high conductivity metal for ensuring electric weld sealing.
CONSTITUTION: A ringed portion to be welded to a metallic container for enclosing a stem base 1 made of copper for example is formed as a recess 9 equal in width to the collar of the container. A projection 10 is made in the recess 9 with the section thereof shaped in table form. A semiconductor substrate 4 is adhered to the surface of the base 1, an upper electrode and the top portion of led-out external lead wire 6 are interconnected with a metallic small-diameter wire 5, the container 2 is placed on the base 1, the collar 3 and base 1 are placed between two presses, and weld sealing is made through the heating of a resistor while pressure is applied by supplying power to the presses. Therefore, the collar 3 of the container contacts with only the upper end surface of the projection 10, and weld portion is heated to a required temperature since the heat generated at the weld portion is not diffused well so that container sealing is performed.
COPYRIGHT: (C)1980,JPO&Japio
JP53152458A 1978-12-07 1978-12-07 semiconductor equipment Expired JPS5854504B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53152458A JPS5854504B2 (en) 1978-12-07 1978-12-07 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53152458A JPS5854504B2 (en) 1978-12-07 1978-12-07 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5578552A true JPS5578552A (en) 1980-06-13
JPS5854504B2 JPS5854504B2 (en) 1983-12-05

Family

ID=15540949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53152458A Expired JPS5854504B2 (en) 1978-12-07 1978-12-07 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5854504B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588965U (en) * 1981-07-08 1983-01-20 日本電気株式会社 Optical semiconductor device
WO2011125649A1 (en) * 2010-04-01 2011-10-13 日立オートモティブシステムズ株式会社 Resistance welded structure, resistance welding method, welded member and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210316483A1 (en) 2018-08-09 2021-10-14 Toray Industries, Inc. Reinforcing fiber tape material and production method thereof, reinforcing fiber layered body and fiber reinforced resin molded body using reinforcing fiber tape material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588965U (en) * 1981-07-08 1983-01-20 日本電気株式会社 Optical semiconductor device
WO2011125649A1 (en) * 2010-04-01 2011-10-13 日立オートモティブシステムズ株式会社 Resistance welded structure, resistance welding method, welded member and manufacturing method thereof
JP2011212735A (en) * 2010-04-01 2011-10-27 Hitachi Automotive Systems Ltd Resistance welding structure, resistance welding method, member to be welded, and its manufacturing method

Also Published As

Publication number Publication date
JPS5854504B2 (en) 1983-12-05

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