JPS5656775A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS5656775A
JPS5656775A JP13207179A JP13207179A JPS5656775A JP S5656775 A JPS5656775 A JP S5656775A JP 13207179 A JP13207179 A JP 13207179A JP 13207179 A JP13207179 A JP 13207179A JP S5656775 A JPS5656775 A JP S5656775A
Authority
JP
Japan
Prior art keywords
heat
substrate
plate
heat pipe
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13207179A
Other languages
Japanese (ja)
Inventor
Riyouichi Sawaai
Ryoichi Ida
Tetsuo Yoshizawa
Yoshikazu Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP13207179A priority Critical patent/JPS5656775A/en
Publication of JPS5656775A publication Critical patent/JPS5656775A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To perform effectively improvement of efficiency and rate of heat transfer and uniformalization of surface temperature by using a heat pipe as a heat source.
CONSTITUTION: A heat source heater 11 is in contact with more than one heat pipe 12 and the heat pipe 12 is in contact with a plate 13. A substrate 14, unmolten solder 15 and a part for mounting to the substrate 14 are fixed on the plate with a jig 17. Heating devices 9 move with rotation of a table 8, and continue heating up to the position of steps 6, 7. A sensor 10 measures the temperature of heated object and on arrival at a set value, cuts the power to the heater off, and starts natural or forced cooling. The solder 15 melts at the set value for the heated object and an electric part 16 is connected on the substrate 14 in a stable state through subsequent cooling. After soldering, the object body is removed from the heat plate of the heating device 9h together with the jig at the position of step 8.
COPYRIGHT: (C)1981,JPO&Japio
JP13207179A 1979-10-13 1979-10-13 Soldering device Pending JPS5656775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13207179A JPS5656775A (en) 1979-10-13 1979-10-13 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13207179A JPS5656775A (en) 1979-10-13 1979-10-13 Soldering device

Publications (1)

Publication Number Publication Date
JPS5656775A true JPS5656775A (en) 1981-05-18

Family

ID=15072825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13207179A Pending JPS5656775A (en) 1979-10-13 1979-10-13 Soldering device

Country Status (1)

Country Link
JP (1) JPS5656775A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488704B (en) * 2012-09-12 2015-06-21 Mustang Ind Corp Equipment used for connectors soldering
JP2019104057A (en) * 2017-12-13 2019-06-27 株式会社シンアペックス Reflow device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488704B (en) * 2012-09-12 2015-06-21 Mustang Ind Corp Equipment used for connectors soldering
JP2019104057A (en) * 2017-12-13 2019-06-27 株式会社シンアペックス Reflow device

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