JPS557860A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS557860A JPS557860A JP8075978A JP8075978A JPS557860A JP S557860 A JPS557860 A JP S557860A JP 8075978 A JP8075978 A JP 8075978A JP 8075978 A JP8075978 A JP 8075978A JP S557860 A JPS557860 A JP S557860A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- vinylphenol
- poly
- thermosetting resin
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 title 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000004615 ingredient Substances 0.000 abstract 2
- 125000000962 organic group Chemical group 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000000615 nonconductor Substances 0.000 abstract 1
- 239000002966 varnish Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: The title composition usable for electrical insulators, capable of exhibiting improved heat resistance while retaining the stability as a varnish, comprising a specific polymaleimide, poly-p-vinylphenol and an epoxy resin.
CONSTITUTION: A resin composition comprising (A) A polymaleimide, e.g. 4,4'- diphenylmethanebismaleimide, of the formula (R1 is n-functional organic group; X1 and X2 are H, halogen, or organic groups; n is an integer ≥2), (B) a poly-p- vinylphenol, and (C) an epoxy resin as, essential ingredients, and, if necessary, (D) a curing accelerator. Preferably, the content of ingredient A is 20W80 wt.%, and the equivalent ratio of (B) to (C) is 0.8W1.2:1.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8075978A JPS557860A (en) | 1978-07-03 | 1978-07-03 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8075978A JPS557860A (en) | 1978-07-03 | 1978-07-03 | Thermosetting resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS557860A true JPS557860A (en) | 1980-01-21 |
Family
ID=13727332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8075978A Pending JPS557860A (en) | 1978-07-03 | 1978-07-03 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS557860A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5177698A (en) * | 1974-12-28 | 1976-07-06 | Sumitomo Bakelite Co | TAINETSUSEIJUSHISOSEIBUTSU |
| JPS5341397A (en) * | 1976-09-28 | 1978-04-14 | Toshiba Corp | Thermosetting resin composition |
| JPS54129097A (en) * | 1978-03-31 | 1979-10-06 | Hitachi Ltd | Resin composition |
-
1978
- 1978-07-03 JP JP8075978A patent/JPS557860A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5177698A (en) * | 1974-12-28 | 1976-07-06 | Sumitomo Bakelite Co | TAINETSUSEIJUSHISOSEIBUTSU |
| JPS5341397A (en) * | 1976-09-28 | 1978-04-14 | Toshiba Corp | Thermosetting resin composition |
| JPS54129097A (en) * | 1978-03-31 | 1979-10-06 | Hitachi Ltd | Resin composition |
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