JPS5582635A - Production of particle board - Google Patents
Production of particle boardInfo
- Publication number
- JPS5582635A JPS5582635A JP15670278A JP15670278A JPS5582635A JP S5582635 A JPS5582635 A JP S5582635A JP 15670278 A JP15670278 A JP 15670278A JP 15670278 A JP15670278 A JP 15670278A JP S5582635 A JPS5582635 A JP S5582635A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- adhesive
- resin
- urea
- surface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 title abstract 2
- 239000000853 adhesive Substances 0.000 abstract 7
- 230000001070 adhesive effect Effects 0.000 abstract 7
- 239000002344 surface layer Substances 0.000 abstract 4
- 229920000877 Melamine resin Polymers 0.000 abstract 3
- 239000004640 Melamine resin Substances 0.000 abstract 3
- 229920001807 Urea-formaldehyde Polymers 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 239000002023 wood Substances 0.000 abstract 3
- 239000003513 alkali Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 abstract 2
- 239000007787 solid Substances 0.000 abstract 2
- 238000007731 hot pressing Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
PURPOSE: To obtain a particle board with excellent surface smoothness and strength by applying to the wood chips an adhesive prepared by adding an alkali phenol resin adhesive to a urea resin or urea-melamine resin adhesive and laminating chips in the form of a mat such that the adhesive-applied chips form the surface layer, and then hot-pressing the laminate.
CONSTITUTION: To a urea resin or urea-melamine resin adhesive is added an alkali phenol resin adhesive in an amount of about 1W30% by weight calculated in resin equivalent. This mixed adhesive is applied to the surface layer chips in an amount of about 10W14% calculated in terms of resin solid based on the wood chip weight. Applied to the inner layer chips is a urea resin or urea-melamine resin adhesive in an amount of about 8W11% calculated in terms of resin solid based on the wood chip weight. Then the surface layer chips, inner layer chips and surface layer chips are laminated in that order to form a mat-like laminate and this laminate is placed in a hot press and hot-pressed at a temperature of about 150W190°C and under pressure of about 20W30kg/cm2.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15670278A JPS5845946B2 (en) | 1978-12-18 | 1978-12-18 | Manufacturing method of particle board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15670278A JPS5845946B2 (en) | 1978-12-18 | 1978-12-18 | Manufacturing method of particle board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5582635A true JPS5582635A (en) | 1980-06-21 |
| JPS5845946B2 JPS5845946B2 (en) | 1983-10-13 |
Family
ID=15633459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15670278A Expired JPS5845946B2 (en) | 1978-12-18 | 1978-12-18 | Manufacturing method of particle board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5845946B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005014250A1 (en) * | 2003-08-08 | 2005-02-17 | Ripetech Pty Limited | Method for reducing precure during the curing of thermosetting resins |
-
1978
- 1978-12-18 JP JP15670278A patent/JPS5845946B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005014250A1 (en) * | 2003-08-08 | 2005-02-17 | Ripetech Pty Limited | Method for reducing precure during the curing of thermosetting resins |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5845946B2 (en) | 1983-10-13 |
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