JPS5582780A - Surface processing method for metal or the like article - Google Patents

Surface processing method for metal or the like article

Info

Publication number
JPS5582780A
JPS5582780A JP15518578A JP15518578A JPS5582780A JP S5582780 A JPS5582780 A JP S5582780A JP 15518578 A JP15518578 A JP 15518578A JP 15518578 A JP15518578 A JP 15518578A JP S5582780 A JPS5582780 A JP S5582780A
Authority
JP
Japan
Prior art keywords
laser light
coating material
fixed temperature
irradiating
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15518578A
Other languages
Japanese (ja)
Inventor
Fumio Hase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15518578A priority Critical patent/JPS5582780A/en
Publication of JPS5582780A publication Critical patent/JPS5582780A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To easily form various surface conditions corresponding to the kind of coating material, by contacting gas or liquid which transmits the light and also, brings on a chemical change at a fixed temperature on the surface of material to be processed and then, irradiating laser light on its surface. CONSTITUTION:The material to be processed 5, such as metals, ceramics, semiconductor etc., is placed in the closed vessel 1 and pre-treatment is carried out cleaning the surface by irradiating laser light from the laser irradiating apparatus 4 through coating material. Gas or liquid of halogen compound transmitting the laser light and bringing on a chemical change (thermal decomposition) at more than a fixed temperature, is used for the above-mentioned coating material through the entrance opening 2 and the exit opening 3. Next, the laser light is irradiated on a fixed place of the surface after carrying out the above-mentioned coating on the surface of the material 5 and corrosive action is carried out on the surface of the material 5 at more than a fixed temperature. The surface is able to process accurately by various process in a wide extent by combining the coating material and laser light.
JP15518578A 1978-12-16 1978-12-16 Surface processing method for metal or the like article Pending JPS5582780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15518578A JPS5582780A (en) 1978-12-16 1978-12-16 Surface processing method for metal or the like article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15518578A JPS5582780A (en) 1978-12-16 1978-12-16 Surface processing method for metal or the like article

Publications (1)

Publication Number Publication Date
JPS5582780A true JPS5582780A (en) 1980-06-21

Family

ID=15600332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15518578A Pending JPS5582780A (en) 1978-12-16 1978-12-16 Surface processing method for metal or the like article

Country Status (1)

Country Link
JP (1) JPS5582780A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819479A (en) * 1981-07-29 1983-02-04 Matsushita Electric Ind Co Ltd Etching method and device
JPS5967634A (en) * 1982-10-09 1984-04-17 Mitsubishi Electric Corp Processing method for semiconductor device
JPS59178192A (en) * 1983-03-28 1984-10-09 Inoue Japax Res Inc Laser working device
JPS59194437A (en) * 1983-04-18 1984-11-05 Mitsubishi Electric Corp Pattern processing apparatus
JPS59197391A (en) * 1983-04-25 1984-11-08 Semiconductor Energy Lab Co Ltd Laser working method
US4692191A (en) * 1985-06-04 1987-09-08 Nippon Steel Corporation Method of improving functions of surface of alloy steel by means of irradiation of laser beam, and alloy steel and structure made by the method
JPS63134679A (en) * 1986-08-08 1988-06-07 クウォンタム　コーポレイション Lithographic method using laser in order to form electronic constitutional element
US4877480A (en) * 1986-08-08 1989-10-31 Digital Equipment Corporation Lithographic technique using laser for fabrication of electronic components and the like
JPH01273687A (en) * 1988-04-25 1989-11-01 Mitsubishi Electric Corp Decomposition/removing apparatus
US5221422A (en) * 1988-06-06 1993-06-22 Digital Equipment Corporation Lithographic technique using laser scanning for fabrication of electronic components and the like
FR2700882A1 (en) * 1993-01-26 1994-07-29 Commissariat Energie Atomique Method and installation for decontaminating a radioactive surface by means of a coherent light beam
JPH07246483A (en) * 1994-03-09 1995-09-26 Toshiba Corp Laser peening method

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819479A (en) * 1981-07-29 1983-02-04 Matsushita Electric Ind Co Ltd Etching method and device
JPS5967634A (en) * 1982-10-09 1984-04-17 Mitsubishi Electric Corp Processing method for semiconductor device
JPS59178192A (en) * 1983-03-28 1984-10-09 Inoue Japax Res Inc Laser working device
JPS59194437A (en) * 1983-04-18 1984-11-05 Mitsubishi Electric Corp Pattern processing apparatus
JPS59197391A (en) * 1983-04-25 1984-11-08 Semiconductor Energy Lab Co Ltd Laser working method
US4692191A (en) * 1985-06-04 1987-09-08 Nippon Steel Corporation Method of improving functions of surface of alloy steel by means of irradiation of laser beam, and alloy steel and structure made by the method
JPS63134679A (en) * 1986-08-08 1988-06-07 クウォンタム　コーポレイション Lithographic method using laser in order to form electronic constitutional element
US4877480A (en) * 1986-08-08 1989-10-31 Digital Equipment Corporation Lithographic technique using laser for fabrication of electronic components and the like
JPH01273687A (en) * 1988-04-25 1989-11-01 Mitsubishi Electric Corp Decomposition/removing apparatus
US5221422A (en) * 1988-06-06 1993-06-22 Digital Equipment Corporation Lithographic technique using laser scanning for fabrication of electronic components and the like
FR2700882A1 (en) * 1993-01-26 1994-07-29 Commissariat Energie Atomique Method and installation for decontaminating a radioactive surface by means of a coherent light beam
WO1994017529A1 (en) * 1993-01-26 1994-08-04 Commissariat A L'energie Atomique Method and equipment for decontaminating a radioactive surface with a coherent light beam
JPH07246483A (en) * 1994-03-09 1995-09-26 Toshiba Corp Laser peening method

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