JPS558362A - Thermocompression bonding method - Google Patents
Thermocompression bonding methodInfo
- Publication number
- JPS558362A JPS558362A JP8130978A JP8130978A JPS558362A JP S558362 A JPS558362 A JP S558362A JP 8130978 A JP8130978 A JP 8130978A JP 8130978 A JP8130978 A JP 8130978A JP S558362 A JPS558362 A JP S558362A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- copper sheet
- conductive layer
- terminal
- intermediate member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 238000005253 cladding Methods 0.000 abstract 1
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000011162 core material Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000010008 shearing Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To make possible obtaining the firm bond of high reliability with minimum pressing force by interposing an intermediate member comprising gold sheet materials on both surfaces of a copper sheet core material at the time of theremocompression bonding the terminals and conductive layer of electronic parts in the production of hybrid integrated circuit devices, etc.
CONSTITUTION: An intermediate member 13 which comprises using a copper sheet 11 of about 50 to 100 μm in thickness and cladding gold sheets 12, 12' of thicknesses 10 to 50 μm on both surfaces of said copper sheet 11 is placed on the conductive layer 2 on a thin film substate 7. Next, the terminal 3 of an electronic part is positioned onto the intermediate part 13, after which a heated compression bonding tool 6 is force contacted to the bonding portion 15 for the specified time. Then, the stress in the shearing direction effective for bonding is generated in the bonding faces 14, 15, whereby the terminal 3 and substrate are bonded.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8130978A JPS558362A (en) | 1978-07-03 | 1978-07-03 | Thermocompression bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8130978A JPS558362A (en) | 1978-07-03 | 1978-07-03 | Thermocompression bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS558362A true JPS558362A (en) | 1980-01-21 |
Family
ID=13742789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8130978A Pending JPS558362A (en) | 1978-07-03 | 1978-07-03 | Thermocompression bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS558362A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08118903A (en) * | 1994-08-31 | 1996-05-14 | Masaaki Nishi | Rim for tire assembly body |
-
1978
- 1978-07-03 JP JP8130978A patent/JPS558362A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08118903A (en) * | 1994-08-31 | 1996-05-14 | Masaaki Nishi | Rim for tire assembly body |
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