JPS558362A - Thermocompression bonding method - Google Patents

Thermocompression bonding method

Info

Publication number: JPS558362A
Authority: JP; Japan
Prior art keywords: bonding; copper sheet; conductive layer; terminal; intermediate member
Prior art date: 1978-07-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP8130978A

Other languages

English (en)

Inventor

Hideo Okamoto

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Corp

Original Assignee

NEC Corp

Nippon Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-07-03

Filing date

1978-07-03

Publication date

1980-01-21

1978-07-03 Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp

1978-07-03 Priority to JP8130978A priority Critical patent/JPS558362A/ja

1980-01-21 Publication of JPS558362A publication Critical patent/JPS558362A/ja

Status Pending legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
229910052802 copper Inorganic materials 0.000 abstract 3
239000010949 copper Substances 0.000 abstract 3
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
229910052737 gold Inorganic materials 0.000 abstract 2
239000010931 gold Substances 0.000 abstract 2
238000005253 cladding Methods 0.000 abstract 1
230000006835 compression Effects 0.000 abstract 1
238000007906 compression Methods 0.000 abstract 1
239000011162 core material Substances 0.000 abstract 1
238000004519 manufacturing process Methods 0.000 abstract 1
239000000463 material Substances 0.000 abstract 1
238000010008 shearing Methods 0.000 abstract 1
239000000758 substrate Substances 0.000 abstract 1
239000010409 thin film Substances 0.000 abstract 1

Landscapes

Pressure Welding/Diffusion-Bonding (AREA)
Wire Bonding (AREA)

JP8130978A 1978-07-03 1978-07-03 Thermocompression bonding method Pending JPS558362A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP8130978A JPS558362A (en)	1978-07-03	1978-07-03	Thermocompression bonding method

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP8130978A JPS558362A (en)	1978-07-03	1978-07-03	Thermocompression bonding method

Publications (1)

Publication Number	Publication Date
JPS558362A true JPS558362A (en)	1980-01-21

Family

ID=13742789

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP8130978A Pending JPS558362A (en)	1978-07-03	1978-07-03	Thermocompression bonding method

Country Status (1)

Country	Link
JP (1)	JPS558362A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08118903A (ja) *	1994-08-31	1996-05-14	Masaaki Nishi	タイヤ組立体用リム

1978
- 1978-07-03 JP JP8130978A patent/JPS558362A/ja active Pending

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08118903A (ja) *	1994-08-31	1996-05-14	Masaaki Nishi	タイヤ組立体用リム

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