JPS5587436A - Method of producing semiconductor device - Google Patents
Method of producing semiconductor deviceInfo
- Publication number
- JPS5587436A JPS5587436A JP16402578A JP16402578A JPS5587436A JP S5587436 A JPS5587436 A JP S5587436A JP 16402578 A JP16402578 A JP 16402578A JP 16402578 A JP16402578 A JP 16402578A JP S5587436 A JPS5587436 A JP S5587436A
- Authority
- JP
- Japan
- Prior art keywords
- film
- high molecular
- molecular material
- sio
- electron beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE: To etch very simply an SiO2 film on an Si substrate by masking the SiO2 film with a high molecular material containing double bond, applying an electron beam or X-rays to the layer of high molecular material to cleave the bond, and exposing the resulting layer of high molecular material to a hydrogen fluoride-containing gas.
CONSTITUTION: When a bore is made in an SiO2 film 12 formed on an Si substrate 11, the film 12 is masked with a photoresist material consisting of a high molecular material. In other words, a film 13, which consists of cyclized polyisoprene the double bonds in which are cleaved when an electron beam or X-rays are applied thereto, is provided on the surface of the film 2. Then, an electron beam is applied in accordance with a predetermined patten to the surface of the film 13. The resulting product is then exposed to hydrogen fluoride gas to etch that portion of the film 12 which is under an unexposed portion of the film 13, earlier than that portion of the film 12 which is under an exposed portion of the film 13. Then, the film 13 is removed to form a desired opening 14 in the film 12. According to this method, a developing step, rinsing step, drying step and pre-treatment included in a conventional method using a photoresist film can be omitted. Moreover, a method according to this invention permits carrying out an etching step at a high accuracy.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16402578A JPS5587436A (en) | 1978-12-25 | 1978-12-25 | Method of producing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16402578A JPS5587436A (en) | 1978-12-25 | 1978-12-25 | Method of producing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5587436A true JPS5587436A (en) | 1980-07-02 |
| JPS6327848B2 JPS6327848B2 (en) | 1988-06-06 |
Family
ID=15785356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16402578A Granted JPS5587436A (en) | 1978-12-25 | 1978-12-25 | Method of producing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5587436A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024095769A1 (en) * | 2022-11-02 | 2024-05-10 | Ａｇｃ株式会社 | Method for manufacturing member having concave structure, and member having concave structure |
| WO2024247461A1 (en) * | 2023-05-31 | 2024-12-05 | Ａｇｃ株式会社 | Method for producing member having recess structure, and member having recess structure |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0236329A (en) * | 1988-07-27 | 1990-02-06 | Showa Electric Wire & Cable Co Ltd | Waterproof test method for pulling eye of cable |
| JPH0669796U (en) * | 1993-03-10 | 1994-09-30 | 東京部品工業株式会社 | External observation type leak detector |
-
1978
- 1978-12-25 JP JP16402578A patent/JPS5587436A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024095769A1 (en) * | 2022-11-02 | 2024-05-10 | Ａｇｃ株式会社 | Method for manufacturing member having concave structure, and member having concave structure |
| WO2024247461A1 (en) * | 2023-05-31 | 2024-12-05 | Ａｇｃ株式会社 | Method for producing member having recess structure, and member having recess structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6327848B2 (en) | 1988-06-06 |
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