JPS5594939A - Pretreatment for carrying out electroless copper plating of epoxy resin substrate - Google Patents

Pretreatment for carrying out electroless copper plating of epoxy resin substrate

Info

Publication number
JPS5594939A
JPS5594939A JP267379A JP267379A JPS5594939A JP S5594939 A JPS5594939 A JP S5594939A JP 267379 A JP267379 A JP 267379A JP 267379 A JP267379 A JP 267379A JP S5594939 A JPS5594939 A JP S5594939A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin substrate
copper plating
cupric chloride
aqueous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP267379A
Other languages
Japanese (ja)
Other versions
JPS6039750B2 (en
Inventor
Fumio Tanimoto
Fumihiro Omori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON DENKI KAGAKU KK
Original Assignee
NIPPON DENKI KAGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON DENKI KAGAKU KK filed Critical NIPPON DENKI KAGAKU KK
Priority to JP267379A priority Critical patent/JPS6039750B2/en
Publication of JPS5594939A publication Critical patent/JPS5594939A/en
Publication of JPS6039750B2 publication Critical patent/JPS6039750B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To enable to form an electroless copper plating film with excellent release strength on an epoxy resin substrate by a method wherein an epoxy resin substrate is treated by an aqueous cupric chloride solution and, thereafter, treated by an aqueous water-soluble peroxide solution.
CONSTITUTION: In carrying out electroless copper plating after a sensitizing treatment is applied to an epoxy resin substrate, an epoxy resin substrate is firstly treated by an aqueous solution containing cupric chloride and, thereafter, by an aqueous solution of a water-soluble peroxide. As an aqueous solution containing cupric chloride, the use of an aqueous 20W40% cupric chloride solution is preferred and, as a water-soluble peroxide, hydrogen peroxide, sodium perborate, sodium percarbonate or the like are mentioned. In case of an epoxy resin substrate having a copper coating or a copper plating layer, e.g., a waste epoxy resin substrate with printed circuit, a copper layer is removed by cupric chloride treatment and an epoxy resin substrate can be regenerated and reused.
COPYRIGHT: (C)1980,JPO&Japio
JP267379A 1979-01-11 1979-01-11 Pretreatment method for electroless copper plating of epoxy resin substrates Expired JPS6039750B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP267379A JPS6039750B2 (en) 1979-01-11 1979-01-11 Pretreatment method for electroless copper plating of epoxy resin substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP267379A JPS6039750B2 (en) 1979-01-11 1979-01-11 Pretreatment method for electroless copper plating of epoxy resin substrates

Publications (2)

Publication Number Publication Date
JPS5594939A true JPS5594939A (en) 1980-07-18
JPS6039750B2 JPS6039750B2 (en) 1985-09-07

Family

ID=11535824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP267379A Expired JPS6039750B2 (en) 1979-01-11 1979-01-11 Pretreatment method for electroless copper plating of epoxy resin substrates

Country Status (1)

Country Link
JP (1) JPS6039750B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277779A (en) * 1989-04-19 1990-11-14 Nisshinbo Ind Inc Method for coating surface of synthetic resin structure with metal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277779A (en) * 1989-04-19 1990-11-14 Nisshinbo Ind Inc Method for coating surface of synthetic resin structure with metal

Also Published As

Publication number Publication date
JPS6039750B2 (en) 1985-09-07

Similar Documents

Publication Publication Date Title
EP0993241B1 (en) Copper coating
ATE183246T1 (en) PRODUCTION OF PRINTED CIRCUITS
EP0257792A3 (en) Composition and method for stripping films from printed circuit boards
IL78267A (en) High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards
DE3267541D1 (en) Method of producing printed circuit boards
JPS5594939A (en) Pretreatment for carrying out electroless copper plating of epoxy resin substrate
JPS5462930A (en) Chemical plating pretreatment method
JPS57140891A (en) Pretreating solution for silver plating
JPS543169A (en) Resin surface treating agent
EP0216513A3 (en) Treatment of drilled copper-clad thermoplastic laminates
JPS5360380A (en) Washing method for membrane having no charge
JPS5521536A (en) Method of forming partial nickel layer
JPS647592A (en) Manufacture of printed wiring board
JPS5638477A (en) Formation of cupric oxide coating
JPS53112229A (en) Partial electroless plating method
GB1332041A (en) Process for forming a conductive coating on a substrate
JPS5212248A (en) Method for treating coated substrate such as boards
JPS5421971A (en) Method of electrodialysis of inorganic electrolytic solution containing organic anions
JPS57187369A (en) Method for peeling off resin film on metal surface
JPS5248258A (en) Method of preventing roducing and accumulation of slime
JPS5566932A (en) Metal plating of molded phenolic resin article
JPS54156346A (en) Purification of metal plating waste water
Moisan et al. Process for Selective Metallization
Sorensen et al. Method of Producing an Alloy or a Mixture of Elements in the Surface of a Substrate
Rimsa Treatment of Drilled Copper-Clad Thermoplastic Laminates