JPS5594969A - Mixture made from polyamideimide resin and epoxide compound - Google Patents
Mixture made from polyamideimide resin and epoxide compoundInfo
- Publication number
- JPS5594969A JPS5594969A JP18480A JP18480A JPS5594969A JP S5594969 A JPS5594969 A JP S5594969A JP 18480 A JP18480 A JP 18480A JP 18480 A JP18480 A JP 18480A JP S5594969 A JPS5594969 A JP S5594969A
- Authority
- JP
- Japan
- Prior art keywords
- polyamideimide resin
- epoxide compound
- mixture made
- epoxide
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004962 Polyamide-imide Substances 0.000 title 1
- -1 epoxide compound Chemical class 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920002312 polyamide-imide Polymers 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54018480A JPS5814841B2 (ja) | 1980-01-07 | 1979-02-21 | 微粒亜鉛の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19792900560 DE2900560A1 (de) | 1979-01-09 | 1979-01-09 | Mischungen aus polyamidimidharzen und epoxidverbindungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5594969A true JPS5594969A (en) | 1980-07-18 |
Family
ID=6060203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18480A Pending JPS5594969A (en) | 1979-01-09 | 1980-01-07 | Mixture made from polyamideimide resin and epoxide compound |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0013767A1 (ja) |
| JP (1) | JPS5594969A (ja) |
| DE (1) | DE2900560A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3363507D1 (en) * | 1982-07-14 | 1986-06-19 | Ciba Geigy Ag | Epoxy resin systems modified with thermoplastic resins |
| JPH02622A (ja) * | 1987-12-01 | 1990-01-05 | Hercules Inc | 複合材が高いガラス転移温度を有し、接着剤に好適なエポキシ樹脂組成物 |
| DE69323129T2 (de) * | 1992-08-11 | 1999-08-19 | Hexcel Corp. | Mit Sulfonpolymeren zäher gemachte hitzehärtbare Harze |
| SG72752A1 (en) * | 1996-10-31 | 2000-05-23 | Hitachi Chemical Co Ltd | Heat resistant resin composition and adhesive sheet using the same |
| US6252010B1 (en) | 1997-10-29 | 2001-06-26 | Hitachi Chemical Company, Ltd. | Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device |
| MY124687A (en) | 1998-05-20 | 2006-06-30 | Hitachi Chemical Co Ltd | Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3458595A (en) * | 1967-01-04 | 1969-07-29 | Anaconda Wire & Cable Co | Epoxidized amide-imide polymeric coating powder |
| US4118535A (en) * | 1975-11-03 | 1978-10-03 | General Electric Company | Novel polyetheramide-imide epoxy resin blends |
-
1979
- 1979-01-09 DE DE19792900560 patent/DE2900560A1/de not_active Withdrawn
- 1979-12-31 EP EP79105415A patent/EP0013767A1/de not_active Withdrawn
-
1980
- 1980-01-07 JP JP18480A patent/JPS5594969A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0013767A1 (de) | 1980-08-06 |
| DE2900560A1 (de) | 1980-07-17 |
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