JPS559639A - Adhesive - Google Patents

Adhesive

Info

Publication number
JPS559639A
JPS559639A JP8201078A JP8201078A JPS559639A JP S559639 A JPS559639 A JP S559639A JP 8201078 A JP8201078 A JP 8201078A JP 8201078 A JP8201078 A JP 8201078A JP S559639 A JPS559639 A JP S559639A
Authority
JP
Japan
Prior art keywords
imidazole
epoxy resin
adhesive
bondage
bisphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8201078A
Other languages
Japanese (ja)
Inventor
Takashi Matsubara
Yoshito Uramoto
Sukeyuki Ishibashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Original Assignee
Toagosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Priority to JP8201078A priority Critical patent/JPS559639A/en
Publication of JPS559639A publication Critical patent/JPS559639A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: An adhesive that is composed of a bisphenol-A type epoxy resin, a carboxylic compound with acrylate bondage and an imidazole, thus having rapid curing speed, high peeling strength and high durability.
CONSTITUTION: Said adhesive comprises (A) a bisphenol-A epoxy resin being solid at room temperature (23°C), (B) a carboxylic compound with acrylate bondage resulting from the reaction between a polyhydric phenol or its derivative and a tri- or more functional aromatic polybasic acid or its ahydride and (C) an imidazole. The epoxy resin has preferably an average molecular weight of 2,000W6,000 and an epoxy equivalent of 1,000W4,000. The imidazole used is, e.g., imidazole, 2-methylimidazole or 2,4-dimethylimidazole.
COPYRIGHT: (C)1980,JPO&Japio
JP8201078A 1978-07-07 1978-07-07 Adhesive Pending JPS559639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8201078A JPS559639A (en) 1978-07-07 1978-07-07 Adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8201078A JPS559639A (en) 1978-07-07 1978-07-07 Adhesive

Publications (1)

Publication Number Publication Date
JPS559639A true JPS559639A (en) 1980-01-23

Family

ID=13762542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8201078A Pending JPS559639A (en) 1978-07-07 1978-07-07 Adhesive

Country Status (1)

Country Link
JP (1) JPS559639A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861163A (en) * 1981-10-09 1983-04-12 Toagosei Chem Ind Co Ltd Powdery adhesive
JPS6089356A (en) * 1983-10-24 1985-05-20 東亞合成株式会社 Adhesive-bonded structure using plated steel plate
JPH0237292A (en) * 1989-06-07 1990-02-07 Sumitomo Light Metal Ind Ltd Condensing heat transmission pipe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861163A (en) * 1981-10-09 1983-04-12 Toagosei Chem Ind Co Ltd Powdery adhesive
JPS6089356A (en) * 1983-10-24 1985-05-20 東亞合成株式会社 Adhesive-bonded structure using plated steel plate
JPH0237292A (en) * 1989-06-07 1990-02-07 Sumitomo Light Metal Ind Ltd Condensing heat transmission pipe

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