JPS559643A - Production of heat-resistant resin paste - Google Patents
Production of heat-resistant resin pasteInfo
- Publication number
- JPS559643A JPS559643A JP8212378A JP8212378A JPS559643A JP S559643 A JPS559643 A JP S559643A JP 8212378 A JP8212378 A JP 8212378A JP 8212378 A JP8212378 A JP 8212378A JP S559643 A JPS559643 A JP S559643A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- solvent
- added
- solution
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006015 heat resistant resin Polymers 0.000 title 1
- 239000002245 particle Substances 0.000 abstract 4
- 229920000642 polymer Polymers 0.000 abstract 4
- 239000002798 polar solvent Substances 0.000 abstract 3
- 239000002904 solvent Substances 0.000 abstract 3
- 125000003118 aryl group Chemical group 0.000 abstract 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 239000004962 Polyamide-imide Substances 0.000 abstract 1
- 239000004760 aramid Substances 0.000 abstract 1
- 229920003235 aromatic polyamide Polymers 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 239000011133 lead Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000001247 metal acetylides Chemical class 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 229920002312 polyamide-imide Polymers 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
PURPOSE: After particles imparting electric characteristics are dispersed oin a specific-concentration solution of a heat-resistant polymer in an organic polar solvent, the polymer and/or the solvent are added to the dispersion to adjust to the specific concentration, thus producing title paste with high dispersibility.
CONSTITUTION: To 5W2000 parts by wt of (A) at least one kind of particles imparting electric characteristics with particle sizes of 20 AW500 microns selected from metals as gold, silver, lead, etc., their oxides, nitrides, carbides, and carbon, and boron, is added (B) a solution of at least one selected from aromatic polyamide, aromatic polyamideimide, and aromatic polyamideacid in an organic polar solvent whose concentration makes the amount of the solvent to be added until the solution reaches Daniel flowing point minimum and the particles are uniformly dispersed. Then, the heat-resistant polymer and/or the organic polar solvent (C) are added to the solution so that the portion of the heat-resistant polymer becomes 100 parts by wt and the solvent becomes 100W5,000 parts.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8212378A JPS559643A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8212378A JPS559643A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS559643A true JPS559643A (en) | 1980-01-23 |
| JPS6157866B2 JPS6157866B2 (en) | 1986-12-09 |
Family
ID=13765631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8212378A Granted JPS559643A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS559643A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60120778A (en) * | 1983-12-05 | 1985-06-28 | Hitachi Chem Co Ltd | Electrically conductive adhesive composition |
| JPS61181135A (en) * | 1985-02-06 | 1986-08-13 | Matsushita Electric Ind Co Ltd | Printed-wiring substrate |
| JPS62106960A (en) * | 1985-11-01 | 1987-05-18 | Nippon Koudoshi Kogyo Kk | Heat-resistant resin composition |
| JPS62179564A (en) * | 1986-02-04 | 1987-08-06 | Nippon Koudoshi Kogyo Kk | Heat-resistant flexible resin composition |
| JPS62261197A (en) * | 1986-05-01 | 1987-11-13 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Manufacture of multilayer ceramic structure |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JPH01110582A (en) * | 1987-10-26 | 1989-04-27 | Toshiba Chem Corp | Heat-resistant adhesive |
| JPH01118586A (en) * | 1987-10-30 | 1989-05-11 | Toshiba Chem Corp | Heat-resistant adhesive |
| JPH0232216A (en) * | 1988-07-22 | 1990-02-02 | Tokyo Keiso Co Ltd | Method and device for measuring flow rate of gas containing condensing component and mist |
| JPH02252786A (en) * | 1989-03-28 | 1990-10-11 | Hitachi Ltd | Heat-resistant adhesive |
| JP2001302807A (en) * | 2000-04-18 | 2001-10-31 | Hitachi Chem Co Ltd | Manufacturing method of resin paste and resin paste |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62197071U (en) * | 1986-06-06 | 1987-12-15 |
-
1978
- 1978-07-07 JP JP8212378A patent/JPS559643A/en active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60120778A (en) * | 1983-12-05 | 1985-06-28 | Hitachi Chem Co Ltd | Electrically conductive adhesive composition |
| JPS61181135A (en) * | 1985-02-06 | 1986-08-13 | Matsushita Electric Ind Co Ltd | Printed-wiring substrate |
| JPS62106960A (en) * | 1985-11-01 | 1987-05-18 | Nippon Koudoshi Kogyo Kk | Heat-resistant resin composition |
| JPS62179564A (en) * | 1986-02-04 | 1987-08-06 | Nippon Koudoshi Kogyo Kk | Heat-resistant flexible resin composition |
| JPS62261197A (en) * | 1986-05-01 | 1987-11-13 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Manufacture of multilayer ceramic structure |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JPH01110582A (en) * | 1987-10-26 | 1989-04-27 | Toshiba Chem Corp | Heat-resistant adhesive |
| JPH01118586A (en) * | 1987-10-30 | 1989-05-11 | Toshiba Chem Corp | Heat-resistant adhesive |
| JPH0232216A (en) * | 1988-07-22 | 1990-02-02 | Tokyo Keiso Co Ltd | Method and device for measuring flow rate of gas containing condensing component and mist |
| JPH02252786A (en) * | 1989-03-28 | 1990-10-11 | Hitachi Ltd | Heat-resistant adhesive |
| JP2001302807A (en) * | 2000-04-18 | 2001-10-31 | Hitachi Chem Co Ltd | Manufacturing method of resin paste and resin paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6157866B2 (en) | 1986-12-09 |
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