JPS5598841A - Electroconductive structure for semiconductor device - Google Patents

Electroconductive structure for semiconductor device

Info

Publication number
JPS5598841A
JPS5598841A JP693079A JP693079A JPS5598841A JP S5598841 A JPS5598841 A JP S5598841A JP 693079 A JP693079 A JP 693079A JP 693079 A JP693079 A JP 693079A JP S5598841 A JPS5598841 A JP S5598841A
Authority
JP
Japan
Prior art keywords
unit
insulating plate
frame
leads
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP693079A
Other languages
Japanese (ja)
Other versions
JPS624854B2 (en
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP693079A priority Critical patent/JPS5598841A/en
Publication of JPS5598841A publication Critical patent/JPS5598841A/en
Publication of JPS624854B2 publication Critical patent/JPS624854B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To make the mounting of a semiconductor device flexible, by providing an insulating plate, which supports the semiconductor device when it is installed in a lead frame and whose size is smaller than that of the device, and connecting the leads of the frame to the electrodes on the board of the device.
CONSTITUTION: An insulating plate 1, which is smaller than an IC unit 5 which is positioned in the opening of a lead frame 7, is provided in the opening of the frame. The opening has a prescribed size. The IC unit is fixed on the insulating plate 1. Electrode connection leads 3 provided on the unit 5 and projecting from the insulating plate 1 are coupled to copper leads 4 through copper wirings 2. The ends of the copper leads 4 are fixed on the external leads 9 of the frame 7. Positioning holes 8 are provided in the four corners of the frame to facilitate positioning to a package or the like. Such a construction is equivalent to the case that an auxiliary wiring layer is provided on the unit, because the area of the insulating plate 1 is smaller than that of the unit 5. This results in raising the flexibility of bonding.
COPYRIGHT: (C)1980,JPO&Japio
JP693079A 1979-01-23 1979-01-23 Electroconductive structure for semiconductor device Granted JPS5598841A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP693079A JPS5598841A (en) 1979-01-23 1979-01-23 Electroconductive structure for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP693079A JPS5598841A (en) 1979-01-23 1979-01-23 Electroconductive structure for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5598841A true JPS5598841A (en) 1980-07-28
JPS624854B2 JPS624854B2 (en) 1987-02-02

Family

ID=11651956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP693079A Granted JPS5598841A (en) 1979-01-23 1979-01-23 Electroconductive structure for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5598841A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113362U (en) * 1988-01-25 1989-07-31

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53105969A (en) * 1977-02-28 1978-09-14 Hitachi Ltd Manufacture of connection structure and wiring for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53105969A (en) * 1977-02-28 1978-09-14 Hitachi Ltd Manufacture of connection structure and wiring for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113362U (en) * 1988-01-25 1989-07-31

Also Published As

Publication number Publication date
JPS624854B2 (en) 1987-02-02

Similar Documents

Publication Publication Date Title
US4249196A (en) Integrated circuit module with integral capacitor
CA1201820A (en) Semiconductor integrated circuit including a lead frame chip support
HK32486A (en) Cast solder leads for leadless semiconductor circuits
JPS55111151A (en) Integrated circuit device
CA2108868A1 (en) Printed circuit board with electric elements mounted thereon
JPS5591849A (en) Module for microwave device
JPS5571030A (en) Mounting system for semiconductor device
EP1041617A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME, AND STRUCTURE AND METHOD FOR FIXING SEMICONDUCTOR
JPS5598841A (en) Electroconductive structure for semiconductor device
JPS6220707B2 (en)
JP2745786B2 (en) TAB semiconductor device
JPS5582454A (en) Container for integrated circuit element
JPS5449066A (en) Semiconductor device
JPS5561046A (en) Packaging device for semiconductor integrated circuit
JPS5353261A (en) Electronic device
JPS5287363A (en) Semiconductor packdage
JP3062102B2 (en) Printed circuit board with heat sink
JPS54102971A (en) Semiconductor device
JPS6442158A (en) Hybrid integrated circuit device
JPH0739244Y2 (en) Hybrid integrated circuit device
JPS6455295A (en) Integrated circuit device
JPS5598840A (en) Electroconductive structure for semiconductor device
JPS5277698A (en) Electronic device
JPS6436030A (en) Semiconductor device
JPS5472966A (en) Electronic device