JPS56103454A - Slaglead - Google Patents

Slaglead

Info

Publication number
JPS56103454A
JPS56103454A JP525380A JP525380A JPS56103454A JP S56103454 A JPS56103454 A JP S56103454A JP 525380 A JP525380 A JP 525380A JP 525380 A JP525380 A JP 525380A JP S56103454 A JPS56103454 A JP S56103454A
Authority
JP
Japan
Prior art keywords
wire
dumet wire
dumet
copper
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP525380A
Other languages
Japanese (ja)
Inventor
Kunio Takahashi
Yoshimi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP525380A priority Critical patent/JPS56103454A/en
Publication of JPS56103454A publication Critical patent/JPS56103454A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To minimize a deformation rate of a dumet wire touched with a semiconductor element by a method wherein an elongation percentage of the dumet wire is specified to 15-20%, in the slagleads composed of the dumet wire used for a glass sealed-type diode and a lead wire. CONSTITUTION:The slagleads are made by connecting the slaglead 1 and the lead wire 2 of a copper covered composite wire to the like by means of an electric resistance welding, the semiconductor element 4 such as Si, Ge is inserted between the pair of the leads 3 and element 4 and the dumet wire 1 touched with the element are surrounded with the sealing glass 5, as leaving the lead wire 2 projected outside. In this construction, the dumet wire 1 is produced by covering an iron-nickel alloyed core metal with copper and covering the surface of the copper with a film of cuprous oxide and a borax, and the dumet wire 1 is easily deformed when heated and this causes the element 4 to be cut into the glass 5. Therefore, the elongation percentage of the dumet wire 1 is decreased by 5-20% to evade the deformation.
JP525380A 1980-01-22 1980-01-22 Slaglead Pending JPS56103454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP525380A JPS56103454A (en) 1980-01-22 1980-01-22 Slaglead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP525380A JPS56103454A (en) 1980-01-22 1980-01-22 Slaglead

Publications (1)

Publication Number Publication Date
JPS56103454A true JPS56103454A (en) 1981-08-18

Family

ID=11606045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP525380A Pending JPS56103454A (en) 1980-01-22 1980-01-22 Slaglead

Country Status (1)

Country Link
JP (1) JPS56103454A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119662A (en) * 1982-01-11 1983-07-16 Sumitomo Electric Ind Ltd Slug lead
EP0824258A1 (en) * 1996-08-09 1998-02-18 Hitachi, Ltd. Structure of electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119662A (en) * 1982-01-11 1983-07-16 Sumitomo Electric Ind Ltd Slug lead
EP0824258A1 (en) * 1996-08-09 1998-02-18 Hitachi, Ltd. Structure of electronic device
US6344790B1 (en) 1996-08-09 2002-02-05 Hitachi, Ltd. Electronic device such as a thermistor and the like with improved corrosion resistance

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