JPS5596665A - Lead component for semiconductor element - Google Patents

Lead component for semiconductor element

Info

Publication number
JPS5596665A
JPS5596665A JP517579A JP517579A JPS5596665A JP S5596665 A JPS5596665 A JP S5596665A JP 517579 A JP517579 A JP 517579A JP 517579 A JP517579 A JP 517579A JP S5596665 A JPS5596665 A JP S5596665A
Authority
JP
Japan
Prior art keywords
tip
lead wire
alloy
magnetic
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP517579A
Other languages
Japanese (ja)
Inventor
Setsu Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Totoku Electric Co Ltd
Original Assignee
Totoku Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Totoku Electric Co Ltd filed Critical Totoku Electric Co Ltd
Priority to JP517579A priority Critical patent/JPS5596665A/en
Publication of JPS5596665A publication Critical patent/JPS5596665A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To impart a magnetic attracting capacity to a lead wire of a two-terminal diode by forming the electrode tip at the end of the lead wire of the diode of Mo or W and forming the lead wire connected to the tip of Cu or Cu alloy coated with Fe or Fe magnetic alloy. CONSTITUTION:A semiconductor pellet 3 is interposed between two lead wires each having an electrode tip 1 at the end. The tip 1 and pellet 3 of the lead wire are sealed with glass 4. In this configuration the tip 1 is made of Mo or W, and the lead wire 2 connected to the tip 1 is made of Cu or Cu alloy coated with Fe or Fe magnetic alloy layer 6 and the surface coated with an oxide preventive layer 7 made of tin plating. Thus, its electric conductivity, thermal conductivity and welding strength are improved, and its welding burr 8 is reduced with its magnetic attracting capacity increased.
JP517579A 1979-01-19 1979-01-19 Lead component for semiconductor element Pending JPS5596665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP517579A JPS5596665A (en) 1979-01-19 1979-01-19 Lead component for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP517579A JPS5596665A (en) 1979-01-19 1979-01-19 Lead component for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5596665A true JPS5596665A (en) 1980-07-23

Family

ID=11603895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP517579A Pending JPS5596665A (en) 1979-01-19 1979-01-19 Lead component for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5596665A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821361A (en) * 1981-07-29 1983-02-08 Nec Home Electronics Ltd Diode
US5001546A (en) * 1983-07-27 1991-03-19 Olin Corporation Clad metal lead frame substrates
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
EP0824258A1 (en) * 1996-08-09 1998-02-18 Hitachi, Ltd. Structure of electronic device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121460A (en) * 1977-03-31 1978-10-23 Hitachi Ltd Electrode lead for semiconductor
JPS5456365A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Glass sealed type semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121460A (en) * 1977-03-31 1978-10-23 Hitachi Ltd Electrode lead for semiconductor
JPS5456365A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Glass sealed type semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821361A (en) * 1981-07-29 1983-02-08 Nec Home Electronics Ltd Diode
US5001546A (en) * 1983-07-27 1991-03-19 Olin Corporation Clad metal lead frame substrates
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
EP0824258A1 (en) * 1996-08-09 1998-02-18 Hitachi, Ltd. Structure of electronic device

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