JPS5610524A - Liquid curable resin composition - Google Patents
Liquid curable resin compositionInfo
- Publication number
- JPS5610524A JPS5610524A JP8674279A JP8674279A JPS5610524A JP S5610524 A JPS5610524 A JP S5610524A JP 8674279 A JP8674279 A JP 8674279A JP 8674279 A JP8674279 A JP 8674279A JP S5610524 A JPS5610524 A JP S5610524A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- prepared
- polyfunctional
- compound
- curable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 title abstract 3
- 239000011342 resin composition Substances 0.000 title abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 239000004643 cyanate ester Substances 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229910052736 halogen Chemical group 0.000 abstract 2
- 150000002367 halogens Chemical group 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 229920006015 heat resistant resin Polymers 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- CWHFDTWZHFRTAB-UHFFFAOYSA-N phenyl cyanate Chemical compound N#COC1=CC=CC=C1 CWHFDTWZHFRTAB-UHFFFAOYSA-N 0.000 abstract 1
- 239000002966 varnish Substances 0.000 abstract 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: A resin composition which is useful in solventless varnishes and solventless adhesives which are liquid at normal temperature, and which, when cured, forms highly heat-resistant resins, prepared by reacting a polyfunctional cyanate ester, a polyfunctional maleimide and a low-viscosity epoxy resin.
CONSTITUTION: A liquid curable resin composition prepared by reacting (A) a polyfunctional cyanate ester, (B) a polyfunctional maleimide and (C) an epoxy resin having a viscosity at 25°C, of below 400 poises. Examples of (A) include di- or tricyanatobenzene and a compound derived by substituting alkyl or halogen for at least one nuclear H of the cyanatobenzene. Example of (B) is a compound of the formula, wherein R is bivalent or trivalent aromatic or cycloaliphatic organic group, X1 and X2 are each H, halogen or alkyl and n is 2 or 3. Example of (C) is a compound prepared by epoxidizing double bonds contained, for example, in butadiene.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8674279A JPS5610524A (en) | 1979-07-09 | 1979-07-09 | Liquid curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8674279A JPS5610524A (en) | 1979-07-09 | 1979-07-09 | Liquid curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5610524A true JPS5610524A (en) | 1981-02-03 |
| JPS6215568B2 JPS6215568B2 (en) | 1987-04-08 |
Family
ID=13895248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8674279A Granted JPS5610524A (en) | 1979-07-09 | 1979-07-09 | Liquid curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5610524A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819614A (en) * | 1981-07-28 | 1983-02-04 | Babcock Hitachi Kk | Fluidized bed combustion device |
| JP2015117300A (en) * | 2013-12-18 | 2015-06-25 | 日立化成株式会社 | Preparation method for thermosetting resin composition varnish, and prepreg, laminate and circuit board using the same |
-
1979
- 1979-07-09 JP JP8674279A patent/JPS5610524A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819614A (en) * | 1981-07-28 | 1983-02-04 | Babcock Hitachi Kk | Fluidized bed combustion device |
| JP2015117300A (en) * | 2013-12-18 | 2015-06-25 | 日立化成株式会社 | Preparation method for thermosetting resin composition varnish, and prepreg, laminate and circuit board using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6215568B2 (en) | 1987-04-08 |
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