JPS56105647A - Probeboard - Google Patents

Probeboard

Info

Publication number
JPS56105647A
JPS56105647A JP757980A JP757980A JPS56105647A JP S56105647 A JPS56105647 A JP S56105647A JP 757980 A JP757980 A JP 757980A JP 757980 A JP757980 A JP 757980A JP S56105647 A JPS56105647 A JP S56105647A
Authority
JP
Japan
Prior art keywords
probe
hole
vertical
substrate
measurement point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP757980A
Other languages
Japanese (ja)
Other versions
JPS5811741B2 (en
Inventor
Yoshie Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP55007579A priority Critical patent/JPS5811741B2/en
Publication of JPS56105647A publication Critical patent/JPS56105647A/en
Publication of JPS5811741B2 publication Critical patent/JPS5811741B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

PURPOSE:To make measurement in high precision possible by a method wherein a vertical through hole is formed in a substrate corresponding to a measurement point to permit a probe with a spring to be inserted, fixed to the substrate on the top and in addition, wired, and a position fitting plate also is perforated the vertical through hole to be piled up. CONSTITUTION:The Al substrate 1 is perforated the vertical through hole 3 corresponding to a measurement point and formed with Al2O3 1a on the surface. A coiled spring 4a and the probe by a needle 4b are inserted into a small hole 3 and the spring at the end is soldered 5 on the top of the substrate to be connected with a lead wire 2. The position fitting plate 7 also has the vertical through hole corresponding to the measurement point and the hole into which the probe is inserted is tapered. With such a construction, a probe plate 1 is piled on the position fitting plate 7 after the position fitting with a waferchip using the position fitting plate 7, thereby allowing the position fittings of the probe and chip to easily be finished, the small hole 3 to guide the probe to correctly be connected to the measurement point and enabling the measurement in high precision to be made.
JP55007579A 1980-01-25 1980-01-25 probe board Expired - Lifetime JPS5811741B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55007579A JPS5811741B2 (en) 1980-01-25 1980-01-25 probe board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55007579A JPS5811741B2 (en) 1980-01-25 1980-01-25 probe board

Publications (2)

Publication Number Publication Date
JPS56105647A true JPS56105647A (en) 1981-08-22
JPS5811741B2 JPS5811741B2 (en) 1983-03-04

Family

ID=11669715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55007579A Expired - Lifetime JPS5811741B2 (en) 1980-01-25 1980-01-25 probe board

Country Status (1)

Country Link
JP (1) JPS5811741B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58173841A (en) * 1982-04-03 1983-10-12 Nippon Denshi Zairyo Kk Card for probe
JPS5999264A (en) * 1982-11-29 1984-06-07 Yoshie Hasegawa Fixed probe board
JPS646564U (en) * 1987-07-02 1989-01-13
JPH05326655A (en) * 1992-07-22 1993-12-10 Tokyo Electron Ltd Measuring method of semiconductor wafer
JP2003066104A (en) * 2001-08-22 2003-03-05 Advantest Corp Insert and electronic component handling apparatus having the same
EP1113274A4 (en) * 1998-07-10 2003-05-02 Nhk Spring Co Ltd CONDUCTIVE CONTACT
KR101171105B1 (en) 2010-05-03 2012-08-03 퀄맥스시험기술 주식회사 contact probe holder
JP2013231626A (en) * 2012-04-27 2013-11-14 Honda Motor Co Ltd Electrification inspection apparatus for semiconductor chip and electrification inspection method of semiconductor chip
WO2014021194A1 (en) * 2012-08-01 2014-02-06 日本電子材料株式会社 Guide plate for probe guard and probe guard provided with same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58173841A (en) * 1982-04-03 1983-10-12 Nippon Denshi Zairyo Kk Card for probe
JPS5999264A (en) * 1982-11-29 1984-06-07 Yoshie Hasegawa Fixed probe board
JPS646564U (en) * 1987-07-02 1989-01-13
JPH05326655A (en) * 1992-07-22 1993-12-10 Tokyo Electron Ltd Measuring method of semiconductor wafer
EP1113274A4 (en) * 1998-07-10 2003-05-02 Nhk Spring Co Ltd CONDUCTIVE CONTACT
JP4880120B2 (en) * 1998-07-10 2012-02-22 日本発條株式会社 Conductive contact
JP2003066104A (en) * 2001-08-22 2003-03-05 Advantest Corp Insert and electronic component handling apparatus having the same
KR101171105B1 (en) 2010-05-03 2012-08-03 퀄맥스시험기술 주식회사 contact probe holder
JP2013231626A (en) * 2012-04-27 2013-11-14 Honda Motor Co Ltd Electrification inspection apparatus for semiconductor chip and electrification inspection method of semiconductor chip
WO2014021194A1 (en) * 2012-08-01 2014-02-06 日本電子材料株式会社 Guide plate for probe guard and probe guard provided with same

Also Published As

Publication number Publication date
JPS5811741B2 (en) 1983-03-04

Similar Documents

Publication Publication Date Title
JPS56105647A (en) Probeboard
JPS56135938A (en) Fixed probe board
JPS5230456A (en) Physical quantity measuring device
JPS53137054A (en) Testing method of soldering
JPS5688345A (en) Semiconductor device
JPS51147255A (en) Semiconductor device
JPS571901A (en) Measuring apparatus for diameter and width of stepped deep hole or groove
JPS55121660A (en) Semiconductor device
JPS5731148A (en) Manufacture of semiconductor device
JPS52125352A (en) Standard sample vessel for measuring thickness of coatings
JPS5396489A (en) Connecting method of lead wire
JPS5574410A (en) Measurement of semiconductor device
JPS5222934A (en) Optical fiber connector
SU694443A1 (en) Device for manufacturing wadder plugs
JPS5439343A (en) Bonding method
JPS5385394A (en) No-strip-coating-connecting wire
JPS547869A (en) Lead bending method of semiconductor device
JPS53103779A (en) Connecting plug for measuring the characteristics of holed core
JPS5629167A (en) Test method of contraction and cracking of mortar and test tool for it
JPS5670446A (en) Measuring method and measuring device employed therefor
JPS5737227B2 (en)
JPS52115177A (en) Semiconductor device
GB1135847A (en) A liquid transfer appliance for use in the analysis of chemicals
JPS528489A (en) Wire contact element with unnecessity of soldering
JPS54115067A (en) Semiconductor device for ultra high frequency