JPS56106983A - Bonding method of film - Google Patents

Bonding method of film

Info

Publication number
JPS56106983A
JPS56106983A JP1040580A JP1040580A JPS56106983A JP S56106983 A JPS56106983 A JP S56106983A JP 1040580 A JP1040580 A JP 1040580A JP 1040580 A JP1040580 A JP 1040580A JP S56106983 A JPS56106983 A JP S56106983A
Authority
JP
Japan
Prior art keywords
films
phenoxy resin
film
under pressure
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1040580A
Other languages
Japanese (ja)
Inventor
Kazuo Matsukura
Kunio Murakami
Yuzo Sekiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to JP1040580A priority Critical patent/JPS56106983A/en
Publication of JPS56106983A publication Critical patent/JPS56106983A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To make it possible to heat bond films with a high adhesive strength to each other at a low temperature in a short time under pressure simply with improved productivity, by using a film of a phenoxy resin as an adhesive.
CONSTITUTION: A film of a phenoxy resin, which is obtained by polymerizing bisphenol A with epichlorohydrin to give a polymerization degree of 100, and has a thickness of preferably 30μ or more, is inserted between films, e.g. consisting of a thermoplastic or thermosetting resin and heat bonded, or two sheets of films on which phenoxy resin films are laminated are superposed on the surfaces of the phenoxy resin films and heat bonded to carry out the bonding under pressure. The heat bonding under pressure is preferably carried out at 110W150°C and 0.3W5kg/ cm2 for 0.2W4sec.
COPYRIGHT: (C)1981,JPO&Japio
JP1040580A 1980-01-30 1980-01-30 Bonding method of film Pending JPS56106983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1040580A JPS56106983A (en) 1980-01-30 1980-01-30 Bonding method of film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1040580A JPS56106983A (en) 1980-01-30 1980-01-30 Bonding method of film

Publications (1)

Publication Number Publication Date
JPS56106983A true JPS56106983A (en) 1981-08-25

Family

ID=11749223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1040580A Pending JPS56106983A (en) 1980-01-30 1980-01-30 Bonding method of film

Country Status (1)

Country Link
JP (1) JPS56106983A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023127668A1 (en) * 2021-12-27 2023-07-06 株式会社レゾナック Method for manufacturing joined body
WO2023127666A1 (en) * 2021-12-27 2023-07-06 株式会社レゾナック Method for producing bonded body

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923810A (en) * 1972-06-29 1974-03-02
JPS5689520A (en) * 1979-12-21 1981-07-20 Unitika Ltd Bonding method of metal plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923810A (en) * 1972-06-29 1974-03-02
JPS5689520A (en) * 1979-12-21 1981-07-20 Unitika Ltd Bonding method of metal plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023127668A1 (en) * 2021-12-27 2023-07-06 株式会社レゾナック Method for manufacturing joined body
WO2023127666A1 (en) * 2021-12-27 2023-07-06 株式会社レゾナック Method for producing bonded body

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