JPS56122155A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS56122155A
JPS56122155A JP2633480A JP2633480A JPS56122155A JP S56122155 A JPS56122155 A JP S56122155A JP 2633480 A JP2633480 A JP 2633480A JP 2633480 A JP2633480 A JP 2633480A JP S56122155 A JPS56122155 A JP S56122155A
Authority
JP
Japan
Prior art keywords
lead frame
leads
semiconductor device
extended
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2633480A
Other languages
Japanese (ja)
Other versions
JPS6050342B2 (en
Inventor
Shinichi Wakabayashi
Sugio Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP55026334A priority Critical patent/JPS6050342B2/en
Publication of JPS56122155A publication Critical patent/JPS56122155A/en
Publication of JPS6050342B2 publication Critical patent/JPS6050342B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To remarkably reduce the cost of a semiconductor device by employing copper alloy or the like for a lead frame. CONSTITUTION:Any of copper, copper alloy and aluminum is used for the material of a lead frame having a stage 1 to which a semiconductor integrated circuit element is placed fixedly, internal leads 2 extended to external leads arranged on the periphery of the stage 1 and external leads 3 extended from the internal leads 2 respectively. The leads disposed slightly inside of a resin seal I and the external leads surrounded by a broken line frame on the surfaces are covered with metal (such as tin) readily solderable thereto. Thus, the cost of the semiconductor device can be remarkably reduced as compared with the conventional lead frame covered with noble metal, and preferable solderability thereof can be maintained.
JP55026334A 1980-03-03 1980-03-03 Lead frame for semiconductor device manufacturing Expired JPS6050342B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55026334A JPS6050342B2 (en) 1980-03-03 1980-03-03 Lead frame for semiconductor device manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55026334A JPS6050342B2 (en) 1980-03-03 1980-03-03 Lead frame for semiconductor device manufacturing

Publications (2)

Publication Number Publication Date
JPS56122155A true JPS56122155A (en) 1981-09-25
JPS6050342B2 JPS6050342B2 (en) 1985-11-08

Family

ID=12190526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55026334A Expired JPS6050342B2 (en) 1980-03-03 1980-03-03 Lead frame for semiconductor device manufacturing

Country Status (1)

Country Link
JP (1) JPS6050342B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4599120A (en) * 1985-02-25 1986-07-08 Brush Wellman Inc. Processing of copper alloys

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224254U (en) * 1985-07-19 1987-02-14
JPS6229537U (en) * 1985-08-08 1987-02-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4599120A (en) * 1985-02-25 1986-07-08 Brush Wellman Inc. Processing of copper alloys

Also Published As

Publication number Publication date
JPS6050342B2 (en) 1985-11-08

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