JPS56136764A - Spooled gold wire for bonding semiconductor element - Google Patents

Spooled gold wire for bonding semiconductor element

Info

Publication number
JPS56136764A
JPS56136764A JP3868880A JP3868880A JPS56136764A JP S56136764 A JPS56136764 A JP S56136764A JP 3868880 A JP3868880 A JP 3868880A JP 3868880 A JP3868880 A JP 3868880A JP S56136764 A JPS56136764 A JP S56136764A
Authority
JP
Japan
Prior art keywords
winding
windings
time
layer
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3868880A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0212863B2 (2
Inventor
Tamotsu Koizumi
Susumu Tomiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP3868880A priority Critical patent/JPS56136764A/ja
Publication of JPS56136764A publication Critical patent/JPS56136764A/ja
Publication of JPH0212863B2 publication Critical patent/JPH0212863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
  • Wire Bonding (AREA)
JP3868880A 1980-03-25 1980-03-25 Spooled gold wire for bonding semiconductor element Granted JPS56136764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3868880A JPS56136764A (en) 1980-03-25 1980-03-25 Spooled gold wire for bonding semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3868880A JPS56136764A (en) 1980-03-25 1980-03-25 Spooled gold wire for bonding semiconductor element

Publications (2)

Publication Number Publication Date
JPS56136764A true JPS56136764A (en) 1981-10-26
JPH0212863B2 JPH0212863B2 (2) 1990-03-28

Family

ID=12532227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3868880A Granted JPS56136764A (en) 1980-03-25 1980-03-25 Spooled gold wire for bonding semiconductor element

Country Status (1)

Country Link
JP (1) JPS56136764A (2)

Also Published As

Publication number Publication date
JPH0212863B2 (2) 1990-03-28

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