JPS5615037A - Manufacture of alloy junction type semiconductor device - Google Patents
Manufacture of alloy junction type semiconductor deviceInfo
- Publication number
- JPS5615037A JPS5615037A JP9244579A JP9244579A JPS5615037A JP S5615037 A JPS5615037 A JP S5615037A JP 9244579 A JP9244579 A JP 9244579A JP 9244579 A JP9244579 A JP 9244579A JP S5615037 A JPS5615037 A JP S5615037A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- alloy
- type semiconductor
- manufacture
- junction type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/50—Alloying conductive materials with semiconductor bodies
Landscapes
- Thyristors (AREA)
Abstract
PURPOSE:To eliminate the necessity of a step of removing a diffused layer and thus simplify the step of manufacturing an alloy junction type semiconductor device by attaching an alloy metal to a high density diffused layer formed in a semiconductor substrate and alloying the metal through the diffused layer with a part of the substrate. CONSTITUTION:High density diffused layers 2a, 2b are formed on both side surfaces of an N-type silicon wafer 1. Then, a P-type alloy metal such as, for example, Al 3 is attached to the surface of one diffused layer 2a, the Al 3 is alloyed to form a P-type alloy layer 4 having a P-N junction at a part of the wafer 1. Thereafter, the vicinity of the P-N junction is etched and removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9244579A JPS5615037A (en) | 1979-07-18 | 1979-07-18 | Manufacture of alloy junction type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9244579A JPS5615037A (en) | 1979-07-18 | 1979-07-18 | Manufacture of alloy junction type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5615037A true JPS5615037A (en) | 1981-02-13 |
Family
ID=14054599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9244579A Pending JPS5615037A (en) | 1979-07-18 | 1979-07-18 | Manufacture of alloy junction type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5615037A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5890466U (en) * | 1981-12-11 | 1983-06-18 | 沖電気工業株式会社 | Banknote discrimination device |
-
1979
- 1979-07-18 JP JP9244579A patent/JPS5615037A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5890466U (en) * | 1981-12-11 | 1983-06-18 | 沖電気工業株式会社 | Banknote discrimination device |
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