JPS56167549U - - Google Patents
Info
- Publication number
- JPS56167549U JPS56167549U JP430081U JP430081U JPS56167549U JP S56167549 U JPS56167549 U JP S56167549U JP 430081 U JP430081 U JP 430081U JP 430081 U JP430081 U JP 430081U JP S56167549 U JPS56167549 U JP S56167549U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981004300U JPS5840614Y2 (ja) | 1981-01-16 | 1981-01-16 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981004300U JPS5840614Y2 (ja) | 1981-01-16 | 1981-01-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56167549U true JPS56167549U (2) | 1981-12-11 |
| JPS5840614Y2 JPS5840614Y2 (ja) | 1983-09-13 |
Family
ID=29600988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981004300U Expired JPS5840614Y2 (ja) | 1981-01-16 | 1981-01-16 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5840614Y2 (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58182858A (ja) * | 1982-04-21 | 1983-10-25 | Nec Corp | リ−ドフレ−ム |
-
1981
- 1981-01-16 JP JP1981004300U patent/JPS5840614Y2/ja not_active Expired
Non-Patent Citations (1)
| Title |
|---|
| ELECTRONIC DESIGN=1967 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58182858A (ja) * | 1982-04-21 | 1983-10-25 | Nec Corp | リ−ドフレ−ム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5840614Y2 (ja) | 1983-09-13 |