JPS5618643A - Preparation of epoxy resin composition - Google Patents

Preparation of epoxy resin composition

Info

Publication number
JPS5618643A
JPS5618643A JP9369979A JP9369979A JPS5618643A JP S5618643 A JPS5618643 A JP S5618643A JP 9369979 A JP9369979 A JP 9369979A JP 9369979 A JP9369979 A JP 9369979A JP S5618643 A JPS5618643 A JP S5618643A
Authority
JP
Japan
Prior art keywords
epoxy resin
compound
group
resin composition
molecule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9369979A
Other languages
Japanese (ja)
Other versions
JPS6314010B2 (en
Inventor
Takeo Ito
Shuji Hayase
Shinichi Sanada
Shiyuuichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9369979A priority Critical patent/JPS5618643A/en
Publication of JPS5618643A publication Critical patent/JPS5618643A/en
Publication of JPS6314010B2 publication Critical patent/JPS6314010B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To obtain titled resin composition, which has a long shelf life as a two- pack type resin, and is quickly curable when mixed, by adding a specified organosilicon compound and an organometallic compound, which have little polymerization activity by themselves, separately to epoxy resins.
CONSTITUTION: (A) An epoxy resin system containing at least one organosilicon compound having at least one silanol group or one Si-bonded hydrolyzable group in one molecule, and (B) another epoxy resin system containing at least one matal compound having an organic group are prepared. They are mixed when used. (A) is preferably an epoxy resin containing an organosilane or organosiloxane compound, having at least one silanol group, or one Si-bonded halogen or alkoxy group in one molecule, and (B) is preferably an epoxy resin containing an organoaluminum compound, e.g. aluminum alcoholate.
COPYRIGHT: (C)1981,JPO&Japio
JP9369979A 1979-07-25 1979-07-25 Preparation of epoxy resin composition Granted JPS5618643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9369979A JPS5618643A (en) 1979-07-25 1979-07-25 Preparation of epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9369979A JPS5618643A (en) 1979-07-25 1979-07-25 Preparation of epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5618643A true JPS5618643A (en) 1981-02-21
JPS6314010B2 JPS6314010B2 (en) 1988-03-29

Family

ID=14089643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9369979A Granted JPS5618643A (en) 1979-07-25 1979-07-25 Preparation of epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5618643A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718754A (en) * 1980-07-08 1982-01-30 Shin Etsu Chem Co Ltd Epoxy-silicone resin composition
JPS61254654A (en) * 1985-05-08 1986-11-12 Toyota Central Res & Dev Lab Inc epoxy resin composition
JPS61268719A (en) * 1985-05-22 1986-11-28 Toyota Central Res & Dev Lab Inc Epoxy resin composition
JPS61291621A (en) * 1985-06-19 1986-12-22 Three Bond Co Ltd Curable composition
JP2008288601A (en) * 2008-05-26 2008-11-27 Sony Chemical & Information Device Corp Electrical equipment
US7491290B2 (en) * 2002-02-21 2009-02-17 Sony Chemical & Information Device Corporation Two-pack type adhesive
WO2014051103A1 (en) 2012-09-28 2014-04-03 三菱化学株式会社 Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718754A (en) * 1980-07-08 1982-01-30 Shin Etsu Chem Co Ltd Epoxy-silicone resin composition
JPS61254654A (en) * 1985-05-08 1986-11-12 Toyota Central Res & Dev Lab Inc epoxy resin composition
JPS61268719A (en) * 1985-05-22 1986-11-28 Toyota Central Res & Dev Lab Inc Epoxy resin composition
JPS61291621A (en) * 1985-06-19 1986-12-22 Three Bond Co Ltd Curable composition
US7491290B2 (en) * 2002-02-21 2009-02-17 Sony Chemical & Information Device Corporation Two-pack type adhesive
JP2008288601A (en) * 2008-05-26 2008-11-27 Sony Chemical & Information Device Corp Electrical equipment
WO2014051103A1 (en) 2012-09-28 2014-04-03 三菱化学株式会社 Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound
US9550877B2 (en) 2012-09-28 2017-01-24 Mitsubishi Chemical Corporation Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound

Also Published As

Publication number Publication date
JPS6314010B2 (en) 1988-03-29

Similar Documents

Publication Publication Date Title
JPS564625A (en) Epoxy resin composition
JPS5618643A (en) Preparation of epoxy resin composition
JPS553410A (en) Preparation of polyolefin
JPS5552338A (en) Oxymethylene copolymer composition
JPS5436363A (en) Polycarbonate resin composition
JPS56166270A (en) Resin composition for road marking
JPS5653109A (en) Preparation of olefin polymer
JPS5755921A (en) Water-resistant epoxy resin composition
JPS5692912A (en) Epoxy resin composition
JPS53104684A (en) Preparation of vinyl chloride polymer
JPS57198050A (en) Bubble gum
JPS5590554A (en) Silicone-epoxy resin composition
JPS57174315A (en) Epoxy resin composition
JPS5466999A (en) Transparent thermosetting resin composition
JPS5710622A (en) Catalyst for polymerizing epoxy compound
JPS56141304A (en) Preparation of polyolefin
JPS5655421A (en) Thermosetting resin composition
JPS5437200A (en) Epoxy resin composition
JPS5790012A (en) Heat-resistant resin composition
JPS57180627A (en) Epoxy resin composition
JPS56139527A (en) Epoxy series resin composition
JPS5725322A (en) Epoxy resin composition
JPS56151726A (en) Epoxy resin composition
JPS53125457A (en) Flame-retardant styrene resin composition
JPS5767641A (en) Flame-retardant styrene resin composition