JPS5718754A - Epoxy-silicone resin composition - Google Patents

Epoxy-silicone resin composition

Info

Publication number
JPS5718754A
JPS5718754A JP9310880A JP9310880A JPS5718754A JP S5718754 A JPS5718754 A JP S5718754A JP 9310880 A JP9310880 A JP 9310880A JP 9310880 A JP9310880 A JP 9310880A JP S5718754 A JPS5718754 A JP S5718754A
Authority
JP
Japan
Prior art keywords
formula
epoxy
hydrocarbon group
composition
substituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9310880A
Other languages
Japanese (ja)
Other versions
JPS626573B2 (en
Inventor
Toshio Shiobara
Shinichi Ide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Chemical Co Ltd
Original Assignee
Shin-Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co Ltd filed Critical Shin-Etsu Chemical Co Ltd
Priority to JP9310880A priority Critical patent/JPS5718754A/en
Publication of JPS5718754A publication Critical patent/JPS5718754A/en
Publication of JPS626573B2 publication Critical patent/JPS626573B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prepare the titled composition capable of sealing a semiconductor device perfectly and preventing the corrosion and breakage of lead wire, and having excellent moisture resistance at high temperature and pressure, by compounding a specific epoxy resin with a specific organic silicon compound.
CONSTITUTION: (A) 70W95wt% of phenolic novolak or cresol epoxy-novolak resin containing ≤2,000ppm of hydrolyzable chlorine atom is compounded with (B) 30W5wt% of an organosilanol of formula I (R1 is substituted or non-substituted monovalent hydrocarbon group; m is 1 or 2; n is 2 or 3; m+n=4), a disilhydrocarbene compound of formula II (R2 is R1; Q is aromatic bivalent hydrocarbon group; p and q are 1 or 2; p+q=3), an organopolysiloxane resin of formula (R3 is R1; Ph is phenyl which together with OH bonds directly to Si atom; R3/Si=1.05W 1.6; Ph/Si=0.2W0.99; OH content=8W10%), or their mixture. The composition is further incorporated with a filler and a curing catalyst to obtain the objective composition.
COPYRIGHT: (C)1982,JPO&Japio
JP9310880A 1980-07-08 1980-07-08 Epoxy-silicone resin composition Granted JPS5718754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9310880A JPS5718754A (en) 1980-07-08 1980-07-08 Epoxy-silicone resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9310880A JPS5718754A (en) 1980-07-08 1980-07-08 Epoxy-silicone resin composition

Publications (2)

Publication Number Publication Date
JPS5718754A true JPS5718754A (en) 1982-01-30
JPS626573B2 JPS626573B2 (en) 1987-02-12

Family

ID=14073322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9310880A Granted JPS5718754A (en) 1980-07-08 1980-07-08 Epoxy-silicone resin composition

Country Status (1)

Country Link
JP (1) JPS5718754A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material for sealing and molded electronic parts using the same
WO2025159022A1 (en) * 2024-01-23 2025-07-31 住友ベークライト株式会社 Flame-retardant resin composition

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150942A (en) * 1974-10-31 1976-05-06 Nippon Paint Co Ltd NETSUKOKASEIHIFUKUSOSEIBUTSU
JPS52107049A (en) * 1976-02-23 1977-09-08 Dow Corning Curing compound for molding
JPS53106754A (en) * 1977-03-01 1978-09-18 Dow Corning Process of crack resistance modification of siloxane molding composition
JPS53147799A (en) * 1977-05-31 1978-12-22 Shin Etsu Chem Co Ltd Curable composition
JPS562319A (en) * 1979-06-21 1981-01-12 Toshiba Corp Epoxy resin composition
JPS5618643A (en) * 1979-07-25 1981-02-21 Toshiba Corp Preparation of epoxy resin composition
JPS56160055A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150942A (en) * 1974-10-31 1976-05-06 Nippon Paint Co Ltd NETSUKOKASEIHIFUKUSOSEIBUTSU
JPS52107049A (en) * 1976-02-23 1977-09-08 Dow Corning Curing compound for molding
JPS53106754A (en) * 1977-03-01 1978-09-18 Dow Corning Process of crack resistance modification of siloxane molding composition
JPS53147799A (en) * 1977-05-31 1978-12-22 Shin Etsu Chem Co Ltd Curable composition
JPS562319A (en) * 1979-06-21 1981-01-12 Toshiba Corp Epoxy resin composition
JPS5618643A (en) * 1979-07-25 1981-02-21 Toshiba Corp Preparation of epoxy resin composition
JPS56160055A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material for sealing and molded electronic parts using the same
WO2025159022A1 (en) * 2024-01-23 2025-07-31 住友ベークライト株式会社 Flame-retardant resin composition

Also Published As

Publication number Publication date
JPS626573B2 (en) 1987-02-12

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