JPS5619039U - - Google Patents
Info
- Publication number
- JPS5619039U JPS5619039U JP1979101526U JP10152679U JPS5619039U JP S5619039 U JPS5619039 U JP S5619039U JP 1979101526 U JP1979101526 U JP 1979101526U JP 10152679 U JP10152679 U JP 10152679U JP S5619039 U JPS5619039 U JP S5619039U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979101526U JPS6020942Y2 (ja) | 1979-07-23 | 1979-07-23 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979101526U JPS6020942Y2 (ja) | 1979-07-23 | 1979-07-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5619039U true JPS5619039U (ja) | 1981-02-19 |
| JPS6020942Y2 JPS6020942Y2 (ja) | 1985-06-22 |
Family
ID=29334269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979101526U Expired JPS6020942Y2 (ja) | 1979-07-23 | 1979-07-23 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020942Y2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198658A (ja) * | 1985-02-27 | 1986-09-03 | Toshiba Corp | 樹脂封止型半導体装置 |
| JP2012244176A (ja) * | 2011-05-17 | 2012-12-10 | Ixys Semiconductor Gmbh | パワー半導体 |
-
1979
- 1979-07-23 JP JP1979101526U patent/JPS6020942Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198658A (ja) * | 1985-02-27 | 1986-09-03 | Toshiba Corp | 樹脂封止型半導体装置 |
| JP2012244176A (ja) * | 2011-05-17 | 2012-12-10 | Ixys Semiconductor Gmbh | パワー半導体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6020942Y2 (ja) | 1985-06-22 |