JPS5619101B2 - - Google Patents

Info

Publication number: JPS5619101B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP6219375A

Other languages

Japanese (ja)

Other versions

JPS51138179A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-05-23

Filing date

1975-05-23

Publication date

1981-05-06

1975-05-23 Application filed filed Critical

1975-05-23 Priority to JP50062193A priority Critical patent/JPS51138179A/ja

1976-05-21 Priority to GB21179/76A priority patent/GB1552144A/en

1976-11-29 Publication of JPS51138179A publication Critical patent/JPS51138179A/ja

1981-05-06 Publication of JPS5619101B2 publication Critical patent/JPS5619101B2/ja

1982-11-25 Priority to HK494/82A priority patent/HK49482A/xx

Status Granted legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
- H10W20/493—Fuses, i.e. interconnections changeable from conductive to non-conductive
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Electric Clocks (AREA)
Semiconductor Integrated Circuits (AREA)
Lead Frames For Integrated Circuits (AREA)

JP50062193A 1975-05-23 1975-05-23 Semi-conductor device Granted JPS51138179A (en)

Priority Applications (3)

Application Number	Priority Date	Filing Date	Title
JP50062193A JPS51138179A (en)	1975-05-23	1975-05-23	Semi-conductor device
GB21179/76A GB1552144A (en)	1975-05-23	1976-05-21	Semi-conductor device
HK494/82A HK49482A (en)	1975-05-23	1982-11-25	Semi-conductor device

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP50062193A JPS51138179A (en)	1975-05-23	1975-05-23	Semi-conductor device

Publications (2)

Publication Number	Publication Date
JPS51138179A JPS51138179A (en)	1976-11-29
JPS5619101B2 true JPS5619101B2 (da)	1981-05-06

Family

ID=13193055

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP50062193A Granted JPS51138179A (en)	1975-05-23	1975-05-23	Semi-conductor device

Country Status (3)

Country	Link
JP (1)	JPS51138179A (da)
GB (1)	GB1552144A (da)
HK (1)	HK49482A (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2046024B (en) *	1979-03-30	1983-01-26	Ferranti Ltd	Circuit assembly
US4484213A (en) *	1982-02-19	1984-11-20	Solitron Devices, Inc.	Binary weighted resistor and package
FR2524707B1 (fr) *	1982-04-01	1985-05-31	Cit Alcatel	Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
JPS59171152A (ja) *	1983-03-17	1984-09-27	Nec Corp	半導体装置
FR2818404B1 (fr) *	2000-12-19	2003-03-21	Valeo Climatisation	Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre

1975
- 1975-05-23 JP JP50062193A patent/JPS51138179A/ja active Granted
1976
- 1976-05-21 GB GB21179/76A patent/GB1552144A/en not_active Expired
1982
- 1982-11-25 HK HK494/82A patent/HK49482A/xx unknown

Also Published As

Publication number	Publication date
GB1552144A (en)	1979-09-12
JPS51138179A (en)	1976-11-29
HK49482A (en)	1982-12-03

Publication	Publication Date	Title
JPS5619101B2 (da)	1981-05-06
CH599281A5 (da)	1978-05-31
CH601112A5 (da)	1978-06-30
BG22430A1 (da)	1977-04-20
BG22450A1 (da)	1977-04-20
BG22511A1 (da)	1977-04-20
BG22565A1 (da)	1977-04-20
BG22770A1 (da)	1977-04-20
BG23260A1 (da)	1977-08-10
CH520675A4 (da)	1976-08-13
CH575303A5 (da)	1976-05-14
CH582320A5 (da)	1976-11-30
CH585143A5 (da)	1977-02-28
CH588663A5 (da)	1977-06-15
CH590422A5 (da)	1977-08-15
CH590967B5 (da)	1977-08-31
CH591798A5 (da)	1977-09-30
CH592268A5 (da)	1977-10-14
CH594585A5 (da)	1978-01-13
CH594959A5 (da)	1978-01-31
CH595153A5 (da)	1978-01-31
CH595589A5 (da)	1978-02-15
CH595948A5 (da)	1978-02-28
CH596845A5 (da)	1978-03-31
CH596903A5 (da)	1978-03-31