JPS5623760A - Manufacture of resin-molded type semiconductor device - Google Patents

Manufacture of resin-molded type semiconductor device

Info

Publication number
JPS5623760A
JPS5623760A JP9729079A JP9729079A JPS5623760A JP S5623760 A JPS5623760 A JP S5623760A JP 9729079 A JP9729079 A JP 9729079A JP 9729079 A JP9729079 A JP 9729079A JP S5623760 A JPS5623760 A JP S5623760A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
type semiconductor
lead
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9729079A
Other languages
Japanese (ja)
Inventor
Hiroshi Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9729079A priority Critical patent/JPS5623760A/en
Publication of JPS5623760A publication Critical patent/JPS5623760A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance the heat dissipating effect of a resin-sealed type semiconductor device by press bending partial leads to bury it in resin by utilizing sealing die when sealing resin and exposing other lead wires on the surface of the resin. CONSTITUTION:A semiconductor pellet 4 is mounted on a flat lead 11 to be wired, and is set in a mold. Leads 9 buried in the resin are raised from the bottom surface of the resin 6 by the projection formed at the upper and the lower dies. The lead 11 is retained in flat state, and is urged onto the surface of the lower die. The resin 6 is sealed in this state. This configuration initially easily heat uniformly when wiring to improve the reliability and by merely selecting the structure of the mold, only tab can be exposed out of the resin unit.
JP9729079A 1979-08-01 1979-08-01 Manufacture of resin-molded type semiconductor device Pending JPS5623760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9729079A JPS5623760A (en) 1979-08-01 1979-08-01 Manufacture of resin-molded type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9729079A JPS5623760A (en) 1979-08-01 1979-08-01 Manufacture of resin-molded type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5623760A true JPS5623760A (en) 1981-03-06

Family

ID=14188363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9729079A Pending JPS5623760A (en) 1979-08-01 1979-08-01 Manufacture of resin-molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5623760A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6078138U (en) * 1983-10-31 1985-05-31 松下電工株式会社 Sealing structure of semiconductor elements
JPS6118010A (en) * 1984-07-04 1986-01-25 Toyoda Mach Works Ltd Manual teaching method of robot
EP0785575A3 (en) * 1996-01-17 1998-09-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6078138U (en) * 1983-10-31 1985-05-31 松下電工株式会社 Sealing structure of semiconductor elements
JPS6118010A (en) * 1984-07-04 1986-01-25 Toyoda Mach Works Ltd Manual teaching method of robot
EP0785575A3 (en) * 1996-01-17 1998-09-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor module

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