JPS562655A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS562655A
JPS562655A JP7848479A JP7848479A JPS562655A JP S562655 A JPS562655 A JP S562655A JP 7848479 A JP7848479 A JP 7848479A JP 7848479 A JP7848479 A JP 7848479A JP S562655 A JPS562655 A JP S562655A
Authority
JP
Japan
Prior art keywords
metal layer
insulating material
prepared
internal lead
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7848479A
Other languages
English (en)
Other versions
JPS6154258B2 (ja
Inventor
Shigeru Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7848479A priority Critical patent/JPS562655A/ja
Publication of JPS562655A publication Critical patent/JPS562655A/ja
Publication of JPS6154258B2 publication Critical patent/JPS6154258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP7848479A 1979-06-21 1979-06-21 Semiconductor device Granted JPS562655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7848479A JPS562655A (en) 1979-06-21 1979-06-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7848479A JPS562655A (en) 1979-06-21 1979-06-21 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS562655A true JPS562655A (en) 1981-01-12
JPS6154258B2 JPS6154258B2 (ja) 1986-11-21

Family

ID=13663255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7848479A Granted JPS562655A (en) 1979-06-21 1979-06-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS562655A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233307A (ja) * 1987-03-20 1988-09-29 Nikon Corp パタ−ン検出装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233307A (ja) * 1987-03-20 1988-09-29 Nikon Corp パタ−ン検出装置

Also Published As

Publication number Publication date
JPS6154258B2 (ja) 1986-11-21

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