JPS56271A - Non-electrolytic copper plating solution - Google Patents
Non-electrolytic copper plating solutionInfo
- Publication number
- JPS56271A JPS56271A JP7461579A JP7461579A JPS56271A JP S56271 A JPS56271 A JP S56271A JP 7461579 A JP7461579 A JP 7461579A JP 7461579 A JP7461579 A JP 7461579A JP S56271 A JPS56271 A JP S56271A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- cupric
- agent
- plating
- polyoxyalkylamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- 239000008139 complexing agent Substances 0.000 abstract 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- 241000047703 Nonion Species 0.000 abstract 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- 239000004094 surface-active agent Substances 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 abstract 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- 229910002651 NO3 Inorganic materials 0.000 abstract 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229910001431 copper ion Inorganic materials 0.000 abstract 1
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- ZVCDLGYNFYZZOK-UHFFFAOYSA-M sodium cyanate Chemical compound [Na]OC#N ZVCDLGYNFYZZOK-UHFFFAOYSA-M 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To render a plating liquid stable and to enhance mechanical property of plated film by a method wherein nonion surfactant based on polyoxyalkylamine is added to a non-electrolytic plating liquid consisting of water soluble cupric salt, complexing agent of cupric ions, etc.
CONSTITUTION: A non-electrolytic plating solution consists of at least one of water soluble cupric salts selected from the group of sulfate, nitrate, etc., at least one of cupric-ion complexing-agents selected from the group of ethylene diamine tetra- acetate, etc., a pH control agent such as alkali metal hydroxides or sulfuric acid, and a reducing agent for copper ions such as formaldehyde. The plating solution may contain a cuprous-ion complexing-agent such as sodium cyanate. To this plating solution, is added a proper amount of nonion surfactant based on polyoxyalkylamine which is obtained by adding amines to PE, PP. In this manner , the plating solution is stabilized, its service life is prolonged, the plating speed is increased, and the mechanical strength of the plated film is enhanced.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7461579A JPS56271A (en) | 1979-06-15 | 1979-06-15 | Non-electrolytic copper plating solution |
| US06/159,231 US4303443A (en) | 1979-06-15 | 1980-06-13 | Electroless copper plating solution |
| DE8080302009T DE3066952D1 (en) | 1979-06-15 | 1980-06-16 | Electroless copper plating solution |
| EP80302009A EP0021757B1 (en) | 1979-06-15 | 1980-06-16 | Electroless copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7461579A JPS56271A (en) | 1979-06-15 | 1979-06-15 | Non-electrolytic copper plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56271A true JPS56271A (en) | 1981-01-06 |
Family
ID=13552245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7461579A Pending JPS56271A (en) | 1979-06-15 | 1979-06-15 | Non-electrolytic copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56271A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192255A (en) * | 1981-05-18 | 1982-11-26 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| JPS59116366A (en) * | 1982-12-24 | 1984-07-05 | Hitachi Ltd | chemical copper plating liquid |
| US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
| JPH02250978A (en) * | 1989-03-23 | 1990-10-08 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| JPH0320474A (en) * | 1989-06-15 | 1991-01-29 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| DE112013006817B4 (en) | 2013-03-13 | 2022-07-14 | Fujifilm Corporation | Image recording device, signal processing method and signal processing program |
| US11447357B2 (en) | 2018-06-13 | 2022-09-20 | Seiko Epson Corporation | Recording device |
-
1979
- 1979-06-15 JP JP7461579A patent/JPS56271A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192255A (en) * | 1981-05-18 | 1982-11-26 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| JPS59116366A (en) * | 1982-12-24 | 1984-07-05 | Hitachi Ltd | chemical copper plating liquid |
| US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
| JPH02250978A (en) * | 1989-03-23 | 1990-10-08 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| JPH0320474A (en) * | 1989-06-15 | 1991-01-29 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| DE112013006817B4 (en) | 2013-03-13 | 2022-07-14 | Fujifilm Corporation | Image recording device, signal processing method and signal processing program |
| US11447357B2 (en) | 2018-06-13 | 2022-09-20 | Seiko Epson Corporation | Recording device |
| US11919735B2 (en) | 2018-06-13 | 2024-03-05 | Seiko Epson Corporation | Recording device |
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