JPS56272A - Non-electrolytic copper plating solution - Google Patents

Non-electrolytic copper plating solution

Info

Publication number
JPS56272A
JPS56272A JP7461679A JP7461679A JPS56272A JP S56272 A JPS56272 A JP S56272A JP 7461679 A JP7461679 A JP 7461679A JP 7461679 A JP7461679 A JP 7461679A JP S56272 A JPS56272 A JP S56272A
Authority
JP
Japan
Prior art keywords
copper
agent
plating solution
ion
integer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7461679A
Other languages
Japanese (ja)
Inventor
Osamu Miyazawa
Hitoshi Oka
Isamu Tanaka
Ataru Yokono
Tokio Isogai
Akira Matsuo
Yoshio Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7461679A priority Critical patent/JPS56272A/en
Priority to US06/159,231 priority patent/US4303443A/en
Priority to DE8080302009T priority patent/DE3066952D1/en
Priority to EP80302009A priority patent/EP0021757B1/en
Publication of JPS56272A publication Critical patent/JPS56272A/en
Pending legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To stabilize a plating solution and to enhance the mechanical properties of plated film by adding a copper-ion complexing agent represented by a specific structural formula to a non-electrolytic solution consisting of a water soluble copper salt, a pH control agent, a copper-ion reducing agent, etc.
CONSTITUTION: A non-electrolytic plating solution consists of at least one of water soluble copper salts selected from the group of sulfate, nitrate, etc., a copper-ion complexing-agent, a copper-ion reducing agent such as formaldehyde, a pH control agne such as alkali metal hydroxides or mineral acids, a stabilizing agent such as sodium cyanate, etc., in which the copper-ion complexing-agent consists of at least one selected from the group of cpds. represented by the specific structural formula (where a, b, and c: an integer of 1W3, n: an integer of 2 or 3). This plating solution provides a plating speed 3 to 7 times as high as that given by a conventional plating solution, and drastically enhances the mechanical strength of plated film obtained.
COPYRIGHT: (C)1981,JPO&Japio
JP7461679A 1979-06-15 1979-06-15 Non-electrolytic copper plating solution Pending JPS56272A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP7461679A JPS56272A (en) 1979-06-15 1979-06-15 Non-electrolytic copper plating solution
US06/159,231 US4303443A (en) 1979-06-15 1980-06-13 Electroless copper plating solution
DE8080302009T DE3066952D1 (en) 1979-06-15 1980-06-16 Electroless copper plating solution
EP80302009A EP0021757B1 (en) 1979-06-15 1980-06-16 Electroless copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7461679A JPS56272A (en) 1979-06-15 1979-06-15 Non-electrolytic copper plating solution

Publications (1)

Publication Number Publication Date
JPS56272A true JPS56272A (en) 1981-01-06

Family

ID=13552275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7461679A Pending JPS56272A (en) 1979-06-15 1979-06-15 Non-electrolytic copper plating solution

Country Status (1)

Country Link
JP (1) JPS56272A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution

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