JPS5629395A - Method of manufacturing printing wire - Google Patents

Method of manufacturing printing wire

Info

Publication number
JPS5629395A
JPS5629395A JP10841080A JP10841080A JPS5629395A JP S5629395 A JPS5629395 A JP S5629395A JP 10841080 A JP10841080 A JP 10841080A JP 10841080 A JP10841080 A JP 10841080A JP S5629395 A JPS5629395 A JP S5629395A
Authority
JP
Japan
Prior art keywords
printing wire
manufacturing printing
manufacturing
wire
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10841080A
Other languages
English (en)
Japanese (ja)
Inventor
Buerunaa Rufu Kurausu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of JPS5629395A publication Critical patent/JPS5629395A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1423—Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • ing And Chemical Polishing (AREA)
JP10841080A 1979-08-09 1980-08-08 Method of manufacturing printing wire Pending JPS5629395A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792932536 DE2932536A1 (de) 1979-08-09 1979-08-09 Verfahren zur herstellung von gedruckten schaltungen

Publications (1)

Publication Number Publication Date
JPS5629395A true JPS5629395A (en) 1981-03-24

Family

ID=6078196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10841080A Pending JPS5629395A (en) 1979-08-09 1980-08-08 Method of manufacturing printing wire

Country Status (10)

Country Link
JP (1) JPS5629395A (de)
CA (1) CA1152226A (de)
CH (1) CH647372A5 (de)
DE (1) DE2932536A1 (de)
FR (1) FR2463569B1 (de)
GB (1) GB2057774B (de)
IE (1) IE49971B1 (de)
IT (1) IT1131716B (de)
NL (1) NL8003939A (de)
SE (1) SE454476B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09102676A (ja) * 1995-08-22 1997-04-15 Macdermid Inc プリント回路板の製造法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3275452D1 (en) * 1982-04-05 1987-03-19 Kanto Kasei Co Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
FI88241C (fi) * 1990-10-30 1993-04-13 Nokia Mobile Phones Ltd Foerfarande foer framstaellning av kretskort
US5358602A (en) * 1993-12-06 1994-10-25 Enthone-Omi Inc. Method for manufacture of printed circuit boards

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5489276A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of producing printed board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1378154A (fr) * 1962-09-24 1964-11-13 North American Aviation Inc Interconnexions électriques pour panneaux de circuits imprimés
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
DE1690224B1 (de) * 1967-08-29 1971-03-25 Standard Elek K Lorenz Ag Bad fuer die stromlose verkupferung von kunststoffplatten
FR2128355A1 (de) * 1971-03-01 1972-10-20 Fernseh Gmbh

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5489276A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of producing printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09102676A (ja) * 1995-08-22 1997-04-15 Macdermid Inc プリント回路板の製造法

Also Published As

Publication number Publication date
FR2463569B1 (fr) 1985-09-20
CH647372A5 (de) 1985-01-15
SE8005443L (sv) 1981-02-10
GB2057774A (en) 1981-04-01
FR2463569A1 (fr) 1981-02-20
GB2057774B (en) 1983-09-07
NL8003939A (nl) 1981-02-11
IE801669L (en) 1981-02-09
CA1152226A (en) 1983-08-16
IT1131716B (it) 1986-06-25
SE454476B (sv) 1988-05-02
DE2932536A1 (de) 1981-02-26
IE49971B1 (en) 1986-01-22
IT8023530A0 (it) 1980-07-18

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