JPS5633457A - Thermally expandable fe-ni-cu alloy - Google Patents

Thermally expandable fe-ni-cu alloy

Info

Publication number
JPS5633457A
JPS5633457A JP10859779A JP10859779A JPS5633457A JP S5633457 A JPS5633457 A JP S5633457A JP 10859779 A JP10859779 A JP 10859779A JP 10859779 A JP10859779 A JP 10859779A JP S5633457 A JPS5633457 A JP S5633457A
Authority
JP
Japan
Prior art keywords
alloy
corrosion resistance
thermally expandable
resistance
obtd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10859779A
Other languages
Japanese (ja)
Other versions
JPS5719742B2 (en
Inventor
Koji Murakami
Keiji Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tohoku Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Metal Industries Ltd filed Critical Tohoku Metal Industries Ltd
Priority to JP10859779A priority Critical patent/JPS5633457A/en
Publication of JPS5633457A publication Critical patent/JPS5633457A/en
Publication of JPS5719742B2 publication Critical patent/JPS5719742B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Joining Of Glass To Other Materials (AREA)

Abstract

PURPOSE:To obtain a inexpensive alloy having high corrosion resistance and thermally expanding characteristics made similar to those of glass, porcelain, resin, etc. by substituting Cu for part of Ni of an Ni-Fe alloy to provide a specified composition. CONSTITUTION:This alloy consists of 34-40wt% Ni, 2-10% Cu and the balance Fe. It is obtd. by lowering the Ni content of an Ni-Fe alloy to <=40% and adding such a specified amount of Cu, and it is equal to the Ni-Fe alloy in corrosion resistance. This alloy has 4-8X10<-6>/ deg.C thermal expansion coefficient at ordinary temp.-300 deg.C. in addition, it has sealing stability, resistance to severe mechanical working and other characteristics, so it can be used as a material for lead frames of a semiconductor device such as IC or LSI, the hermetic sealing portion of a car head light, etc.
JP10859779A 1979-08-28 1979-08-28 Thermally expandable fe-ni-cu alloy Granted JPS5633457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10859779A JPS5633457A (en) 1979-08-28 1979-08-28 Thermally expandable fe-ni-cu alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10859779A JPS5633457A (en) 1979-08-28 1979-08-28 Thermally expandable fe-ni-cu alloy

Publications (2)

Publication Number Publication Date
JPS5633457A true JPS5633457A (en) 1981-04-03
JPS5719742B2 JPS5719742B2 (en) 1982-04-24

Family

ID=14488829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10859779A Granted JPS5633457A (en) 1979-08-28 1979-08-28 Thermally expandable fe-ni-cu alloy

Country Status (1)

Country Link
JP (1) JPS5633457A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650550A (en) * 1979-10-02 1981-05-07 Toshiba Corp Semiconductor device
JPS5651555A (en) * 1979-10-03 1981-05-09 Toshiba Corp Dumet wire
JPS58141366A (en) * 1982-02-16 1983-08-22 Toshiba Corp Parts in tube
JPS5935654A (en) * 1982-08-18 1984-02-27 Nippon Kinzoku Kogyo Kk Alloy for glass sealing
CN109746455A (en) * 2019-03-19 2019-05-14 湖南恒基粉末科技有限责任公司 A kind of cupric kovar alloy and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650550A (en) * 1979-10-02 1981-05-07 Toshiba Corp Semiconductor device
JPS5651555A (en) * 1979-10-03 1981-05-09 Toshiba Corp Dumet wire
JPS58141366A (en) * 1982-02-16 1983-08-22 Toshiba Corp Parts in tube
JPS5935654A (en) * 1982-08-18 1984-02-27 Nippon Kinzoku Kogyo Kk Alloy for glass sealing
CN109746455A (en) * 2019-03-19 2019-05-14 湖南恒基粉末科技有限责任公司 A kind of cupric kovar alloy and preparation method thereof

Also Published As

Publication number Publication date
JPS5719742B2 (en) 1982-04-24

Similar Documents

Publication Publication Date Title
ES8608974A1 (en) PROCEDURE FOR PREPARING A TAN-TALO POWDER COMPOSITION
KR920021454A (en) Zinc Phosphate Low Temperature Glass
GB1231517A (en)
KR830001400A (en) Three-way amorphous alloy of iron, boron, and silicon
JPS5633457A (en) Thermally expandable fe-ni-cu alloy
ATE180517T1 (en) IRON-ALUMINUM ALLOY AND USE OF THIS ALLOY
KR870000255A (en) Glass for tungsten-halogen lamp cover
GB2146937B (en) Semiconductor device and method of manufacturing the same
JPS5729557A (en) Improved invar alloy
JPS5212573A (en) Reed frame
SE8107844L (en) SET TO MAKE CORNORIENTED SILICONE
FR2453120A1 (en) MANUFACTURED ARTICLE COMPRISING AN ALUMINUM CERAMIC BODY LINKED BY A SEALING AGENT TO A CERAMIC OR REFRACTORY METAL PIECE
JPS6484739A (en) Resin sealed semiconductor device
JPS5516732A (en) Brazing material for portable watch
JPS52151891A (en) Resistor body for high temperature
GB918498A (en) Mercury-indium-thallium alloys
JPS5611402A (en) Reflector
US2767086A (en) Low expansion alloy
SU482403A1 (en) Glass
JPS5650550A (en) Semiconductor device
GB1248678A (en) Improvements in or relating to glasses
JPS5638846A (en) Semiconductor device
SU367171A1 (en) IRON-BASED ALLOY
KR880007385A (en) Manufacturing method of luminous material
GB766368A (en) Improvements in or relating to brazing alloys

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081102

Year of fee payment: 7

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091102

Year of fee payment: 8

LAPS Cancellation because of no payment of annual fees