JPS6484739A - Resin sealed semiconductor device - Google Patents
Resin sealed semiconductor deviceInfo
- Publication number
- JPS6484739A JPS6484739A JP24490787A JP24490787A JPS6484739A JP S6484739 A JPS6484739 A JP S6484739A JP 24490787 A JP24490787 A JP 24490787A JP 24490787 A JP24490787 A JP 24490787A JP S6484739 A JPS6484739 A JP S6484739A
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- particle size
- average particle
- surface area
- elastic modulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 229910052710 silicon Inorganic materials 0.000 abstract 5
- 239000010703 silicon Substances 0.000 abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 3
- 239000002131 composite material Substances 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 239000005350 fused silica glass Substances 0.000 abstract 3
- 239000002245 particle Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- 238000007789 sealing Methods 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain a highly reliable device which exhibits an excellent property of low stress and the like, by sealing a semiconductor element with an epoxy resin composite containing to the extent beyond respective specific amounts with respect to rubber-like silicon where its average particle size is less than specified value as well as fused silica where its specific surface area is more than specified value. CONSTITUTION:At a resin sealed semiconductor device where a semiconductor element is sealed by an epoxy resin composite, its device makes the epoxy resin composite contain more than 2wt.% of rubber-like silicon having its average particle size 10mum or less and more than 65wt.% of fused silica having its specific surface area 0.25m<2>/g or more as well. It is preferable for the foregoing silicon to have a property where the smaller its average particle size is, the smaller its elastic modulus of a sealed resin becomes and there is a tendency where the more the content of silicon is, the lower its linear expansion coefficient and elastic modulus become. The use of silicon having a large specific surface area like the foregoing one as fused silica improves resin intensity, though it leaves linear expansion coefficient as well as elastic modulus as it is.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24490787A JPS6484739A (en) | 1987-09-28 | 1987-09-28 | Resin sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24490787A JPS6484739A (en) | 1987-09-28 | 1987-09-28 | Resin sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6484739A true JPS6484739A (en) | 1989-03-30 |
Family
ID=17125738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24490787A Pending JPS6484739A (en) | 1987-09-28 | 1987-09-28 | Resin sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6484739A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01113453A (en) * | 1987-10-27 | 1989-05-02 | Matsushita Electric Works Ltd | Epoxy resin composition |
| JPH083451A (en) * | 1994-06-16 | 1996-01-09 | Tatsumori:Kk | Composition containing silica and silicone rubber and its production |
| JP2016056371A (en) * | 2010-05-07 | 2016-04-21 | 住友ベークライト株式会社 | Laminated substrate for printed wiring board, laminated body for printed wiring board, printed wiring board, and semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58108220A (en) * | 1981-12-21 | 1983-06-28 | Mitsubishi Gas Chem Co Inc | Epoxy resin composition for semiconductor encapsulation |
| JPS61215615A (en) * | 1985-03-22 | 1986-09-25 | Denki Kagaku Kogyo Kk | Resin composition for sealing semiconductor |
| JPS6210132A (en) * | 1985-07-05 | 1987-01-19 | Hitachi Chem Co Ltd | Resin composition for sealing semiconductor |
| JPS6210159A (en) * | 1985-07-05 | 1987-01-19 | Hitachi Chem Co Ltd | Resin composition for semiconductor sealing |
| JPS62270617A (en) * | 1986-05-20 | 1987-11-25 | Mitsui Toatsu Chem Inc | Resin composition for semiconductor sealing |
-
1987
- 1987-09-28 JP JP24490787A patent/JPS6484739A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58108220A (en) * | 1981-12-21 | 1983-06-28 | Mitsubishi Gas Chem Co Inc | Epoxy resin composition for semiconductor encapsulation |
| JPS61215615A (en) * | 1985-03-22 | 1986-09-25 | Denki Kagaku Kogyo Kk | Resin composition for sealing semiconductor |
| JPS6210132A (en) * | 1985-07-05 | 1987-01-19 | Hitachi Chem Co Ltd | Resin composition for sealing semiconductor |
| JPS6210159A (en) * | 1985-07-05 | 1987-01-19 | Hitachi Chem Co Ltd | Resin composition for semiconductor sealing |
| JPS62270617A (en) * | 1986-05-20 | 1987-11-25 | Mitsui Toatsu Chem Inc | Resin composition for semiconductor sealing |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01113453A (en) * | 1987-10-27 | 1989-05-02 | Matsushita Electric Works Ltd | Epoxy resin composition |
| JPH083451A (en) * | 1994-06-16 | 1996-01-09 | Tatsumori:Kk | Composition containing silica and silicone rubber and its production |
| JP2016056371A (en) * | 2010-05-07 | 2016-04-21 | 住友ベークライト株式会社 | Laminated substrate for printed wiring board, laminated body for printed wiring board, printed wiring board, and semiconductor device |
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