JPS5635026B2 - - Google Patents
Info
- Publication number
- JPS5635026B2 JPS5635026B2 JP8215378A JP8215378A JPS5635026B2 JP S5635026 B2 JPS5635026 B2 JP S5635026B2 JP 8215378 A JP8215378 A JP 8215378A JP 8215378 A JP8215378 A JP 8215378A JP S5635026 B2 JPS5635026 B2 JP S5635026B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/331—Shapes of die-attach connectors
- H10W72/334—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
- H10W72/387—Flow barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/879—Bump connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82419777A | 1977-08-12 | 1977-08-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5432074A JPS5432074A (en) | 1979-03-09 |
| JPS5635026B2 true JPS5635026B2 (fr) | 1981-08-14 |
Family
ID=25240847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8215378A Granted JPS5432074A (en) | 1977-08-12 | 1978-07-07 | Heat transfer unit |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0000856B1 (fr) |
| JP (1) | JPS5432074A (fr) |
| CA (1) | CA1102010A (fr) |
| DE (1) | DE2861442D1 (fr) |
| IT (1) | IT1112288B (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09210801A (ja) * | 1996-02-05 | 1997-08-15 | Yuji Inomata | 流路内配置用検知装置 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2495846A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Dispositif de connexion electrique a haute densite de contacts |
| FR2495838A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Dispositif de refroidissement amovible pour supports de circuits integres |
| US5594355A (en) * | 1994-07-19 | 1997-01-14 | Delta Design, Inc. | Electrical contactor apparatus for testing integrated circuit devices |
| FR2811476B1 (fr) * | 2000-07-07 | 2002-12-06 | Thomson Csf | Dispositif electronique avec encapsulant thermiquement conducteur |
| US7031160B2 (en) * | 2003-10-07 | 2006-04-18 | The Boeing Company | Magnetically enhanced convection heat sink |
| US7516778B2 (en) | 2005-09-06 | 2009-04-14 | Sun Microsystems, Inc. | Magneto-hydrodynamic heat sink |
| US8730674B2 (en) * | 2011-12-12 | 2014-05-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Magnetic fluid cooling devices and power electronics assemblies |
| JP6036431B2 (ja) * | 2013-03-18 | 2016-11-30 | 富士通株式会社 | 半導体装置 |
| CN114390772B (zh) * | 2021-12-29 | 2024-03-08 | 江苏密特科智能装备制造有限公司 | 一种半导体设备精密组件 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3706127A (en) * | 1970-04-27 | 1972-12-19 | Ibm | Method for forming heat sinks on semiconductor device chips |
| GB1441433A (en) * | 1973-09-18 | 1976-06-30 | Ind Instr Ltd | Heat conductive pastes |
-
1978
- 1978-06-14 CA CA305,488A patent/CA1102010A/fr not_active Expired
- 1978-07-07 JP JP8215378A patent/JPS5432074A/ja active Granted
- 1978-07-20 DE DE7878430006T patent/DE2861442D1/de not_active Expired
- 1978-07-20 EP EP78430006A patent/EP0000856B1/fr not_active Expired
- 1978-07-26 IT IT26104/78A patent/IT1112288B/it active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09210801A (ja) * | 1996-02-05 | 1997-08-15 | Yuji Inomata | 流路内配置用検知装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| IT7826104A0 (it) | 1978-07-26 |
| EP0000856A1 (fr) | 1979-02-21 |
| EP0000856B1 (fr) | 1981-12-16 |
| DE2861442D1 (en) | 1982-02-11 |
| CA1102010A (fr) | 1981-05-26 |
| JPS5432074A (en) | 1979-03-09 |
| IT1112288B (it) | 1986-01-13 |