JPS5636139Y2 - - Google Patents
Info
- Publication number
- JPS5636139Y2 JPS5636139Y2 JP1976081668U JP8166876U JPS5636139Y2 JP S5636139 Y2 JPS5636139 Y2 JP S5636139Y2 JP 1976081668 U JP1976081668 U JP 1976081668U JP 8166876 U JP8166876 U JP 8166876U JP S5636139 Y2 JPS5636139 Y2 JP S5636139Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976081668U JPS5636139Y2 (ja) | 1976-06-21 | 1976-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976081668U JPS5636139Y2 (ja) | 1976-06-21 | 1976-06-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53764U JPS53764U (ja) | 1978-01-06 |
| JPS5636139Y2 true JPS5636139Y2 (ja) | 1981-08-25 |
Family
ID=28561529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976081668U Expired JPS5636139Y2 (ja) | 1976-06-21 | 1976-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5636139Y2 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057165A (ja) * | 1983-09-09 | 1985-04-02 | 三菱重工業株式会社 | 冷凍装置 |
-
1976
- 1976-06-21 JP JP1976081668U patent/JPS5636139Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53764U (ja) | 1978-01-06 |