JPS5636152A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5636152A JPS5636152A JP11199779A JP11199779A JPS5636152A JP S5636152 A JPS5636152 A JP S5636152A JP 11199779 A JP11199779 A JP 11199779A JP 11199779 A JP11199779 A JP 11199779A JP S5636152 A JPS5636152 A JP S5636152A
- Authority
- JP
- Japan
- Prior art keywords
- resistance
- openings
- whose
- mask
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To form a plurality of regions, whose specific resistance differs, and make up a plurality of resistance elements, whose resistance values differ each other, by a method wherein an oxide film mask is built up on a semiconductor substrate, a polyimide group high-molecular resin film mask is formed on the oxide film mask, and the ions of impurities are injected. CONSTITUTION:An oxide film mask 2 of SiO2 is made up on a semiconductor substrate 1 such as Si. Openings such as three openings 2a, 2b, 2c are formed to the mask. A film such as a polyimide-isoindoloquinazolinedione film 3 is applied on the openings. An opening 3a is made up to the resin film 3 on the openings 2a, ions are injected, and the first resistance region 4a is formed. The second and third resistance regions 4b, 4c are successively built up in the same manner. Thereby, resistance elements, whose sheet resistance differs, each other that is, whose resistance values differ, can be formed highly accurately and positively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11199779A JPS5636152A (en) | 1979-08-31 | 1979-08-31 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11199779A JPS5636152A (en) | 1979-08-31 | 1979-08-31 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5636152A true JPS5636152A (en) | 1981-04-09 |
Family
ID=14575355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11199779A Pending JPS5636152A (en) | 1979-08-31 | 1979-08-31 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5636152A (en) |
-
1979
- 1979-08-31 JP JP11199779A patent/JPS5636152A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5643749A (en) | Semiconductor device and its manufacture | |
| JPS56115557A (en) | Manufacture of semiconductor device | |
| JPS5331964A (en) | Production of semiconductor substrates | |
| JPS5444870A (en) | Manufacture of semiconductor device | |
| JPS5458381A (en) | Manufacture for semiconductor device | |
| JPS577925A (en) | Manufacture of thin film integrated circuit | |
| JPS5534433A (en) | Preparation of semiconductor device | |
| JPS5513953A (en) | Complementary integrated circuit | |
| JPS5791537A (en) | Manufacture of semiconductor device | |
| JPS5283073A (en) | Production of semiconductor device | |
| JPS5680154A (en) | Production of semiconductor device | |
| JPS5633841A (en) | Manufacture of semiconductor device | |
| JPS56111240A (en) | Semiconductor device and manufacture thereof | |
| JPS5548950A (en) | Manufacturing of semiconductor device | |
| JPS5661164A (en) | Mos semiconductor device | |
| JPS55160469A (en) | Manufacture of semiconductor device | |
| JPS5680129A (en) | Manufacture of semiconductor device | |
| JPS56115523A (en) | Manufacture of semiconductor device | |
| JPS56155561A (en) | Semiconductor device and manufacture therefor | |
| JPS5776857A (en) | Manufacture of semiconductor device | |
| JPS5267971A (en) | Manufacture of integrated circuit wafer | |
| JPS5513952A (en) | Manufacturing method of semiconductor device | |
| JPS5735344A (en) | Manufacturing method of semiconductor device | |
| JPS56138937A (en) | Semiconductor evaluation element | |
| JPS56116618A (en) | Manufacture of semiconductor device |